Abstract:The acquisition of a "stabilized" solution is necessary for the consistent evaluation of the solder joint thermal fatigue damage by the common finite element (FE) based modeling approaches. Yet, there are no universal guidelines developed for this purpose. The present study aims to provide insight into this subject. A 1-D analytical model is firstly developed for this study. The balance between the "forward creep strain" and the "backward creep strain" is observed to be the driving force that leads to solution… Show more
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