Designing manufacturable MEMS in CMOS-compatible processes: methodology and case studies

Schropfer, G.; McNie, Mark E.; Silva, Mark da; Davies, R.; Rickard, Alexandra L.; Musalem, F.-X.

doi:10.1117/12.544971

Cited by 14 publications

(10 citation statements)

References 9 publications

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“…MEMS design is a complex process, because it is important to design and optimize the coupling between the micromachined elements and the microelectronics circuits that control them and condition the signal (Schropfer et al 2004). The micromachined element designer should be an expert from the design type/domain in which he is working and the sensing & actuation technique used for the design (Liu 2006;Senturia 2001).…”

Section: Design Subsystemmentioning

confidence: 99%

“…Different sub-subsystems identified for materials subsystem are shown in Fig. 3 (Schropfer et al 2004;Liu 2006;Zha and Du 2003;Judy and Myung 2002;Gilleo 2005).…”

Section: Materials Subsystemmentioning

confidence: 99%

“…It promises to revolutionize nearly every product category by bringing together silicon-based microelectronics with manufacturing technology, their by making possible the realization of complete Systems-on-a-Chip (SOC) (Kovacs 1998;Gardner 1994). Since the complexity of MEMS increases, it is becoming increasingly important to design and optimize the coupling between the micromachined elements, the microelectronics circuits that control them and condition the signal and the constraints due to packaging (Schropfer et al 2004). MEMS design must be separated from the complexities of the fabrication sequence and packaging process with consideration of different materials, process and environment (MEMS-Exchange 2008;Reithel 2008).…”

Section: Introductionmentioning

confidence: 99%

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Structural modelling and integrative analysis of microelectromechanical systems product using graph theoretic approach

Prince

Agrawal

2009

Microsyst Technol

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Micro-electromechanical systems (MEMS) as an enabling technology is seen to play a more and more important role for the main stream of industry of the future by broadening its applications to information, communications and bio technologies. Development of MEMS devices, however, still relies on knowledge and experience of MEMS experts due to the design and fabrication process complexity. It is difficult to understand the trade-offs inherent in the system and achieve an optimal structure without any MEMS-related insight. An attempt is made to develop an integrated systems model for the complete structure of the MEMS product system in terms of its constituents and interactions between the constituents. The hierarchical tree structures of the MEMS system and its subsystems are presented up to component level. For characterization, analysis and identification of MEMS product system, three different mathematical models say graph theoretic model, matrix model and permanent model are presented. These models are associated with graph theory, matrix method and variable permanent function by considering the various subsystems, subsubsystems up to component level, their connectivity and interdependency of the MEMS product system. The developed methodology is explained with an example. The proposed modeling and analysis is extendable to the subsystems and the component level. An overall structural analysis can be carried out by following a 'top-down' approach or 'bottom-up' approach. Understanding of MEMS product structure will help in the improvement of performance, cost, design time, and so on.

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Section: Design Subsystemmentioning

confidence: 99%

“…Different sub-subsystems identified for materials subsystem are shown in Fig. 3 (Schropfer et al 2004;Liu 2006;Zha and Du 2003;Judy and Myung 2002;Gilleo 2005).…”

Section: Materials Subsystemmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Structural modelling and integrative analysis of microelectromechanical systems product using graph theoretic approach

Prince

Agrawal

2009

Microsyst Technol

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“…Regarding MEMS, DFM is proclaimed available through usage [8] of the MEMS design tools CoventorWareTM, composed of four main products, of which ARCHITECT, ANALYSER and INTEGRATOR. We will try to value the assistance provided by such method in the crucial problem of process selection.…”

Section: Design For Manufacturability For Memsmentioning

confidence: 99%

Integrated design of MEMS: aiming at manufacturability

Museau

Masclet

Tichkiewitch

2007

Int J Interact Des Manuf

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This paper is a first attempt to qualify the design process in the field of MEMS product. Through this study, we try to analyse how the issue of manufacturability is addressed in a context of integrated design. This implies to understand specificities of the manufacturing process involved in the realization of these products (we focus on process derived from VLSI industry). Then we look at the main current design methodologies to understand how the manufacturing is being taken into account. Computer aided tools associated to these methodologies are presented at the same time. Finally, we conclude on the need of specifications for a design methodology that would provide designers with greater independence from manufacturing constraints.

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“…The application range of heterogeneous devices is not limited to automotive, aerospace, and biomedical domains only. Multi-module system design challenges stimulate technical and technological development from the device design, and simulation technique, to the device testing and fabrication and assembly [3]. This paper presents a heterogeneous system for thermal simulations of heterogeneous devices.…”

Section: Introductionmentioning

confidence: 99%

Integrated thermal modeling of heterogeneous eCubes stacked devices

Janczyk

Bieniek

Grabiec

et al. 2008

2008 14th International Workshop on Thermal Inveatigation of ICs and Systems

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Vertical chip integration applied in heterogeneous systems is a design approach used to extend the device functionality and improve its performance. Apart from the design advancements, thermal budget of the device is constrained internal structure of the device. Internal module components limit the efficiency of device cooling. It is one of the most important concerns of vertical integration reliability. Development of vertically integrated devices requires cooperation of different partners and designers. This paper presents thermo-mechanical simulation needs and capabilities. The presented HDL approach is used for thermal modeling of the structure and high level, NDA-proof thermal simulations of modules of stacked, heterogeneous devices.

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Designing manufacturable MEMS in CMOS-compatible processes: methodology and case studies

Cited by 14 publications

References 9 publications

Structural modelling and integrative analysis of microelectromechanical systems product using graph theoretic approach

Structural modelling and integrative analysis of microelectromechanical systems product using graph theoretic approach

Integrated design of MEMS: aiming at manufacturability

Integrated thermal modeling of heterogeneous eCubes stacked devices

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