Design rule development for microwave flip-chip applications

Organic Packages With Embedded Phased-Array Antennas for 60-GHz Wireless Chipsets

“…A comprehensive sensitivity analysis [18] was conducted to optimize the controlled collapse chip connect (C4) joint, including pad size and pitch, bump diameter and height, and pad configuration (e.g., GSGSG versus GSSG in case of differential signaling). To summarize the results, a smaller pad with a larger pitch and a smaller bump diameter is generally preferable (listed in the order from the most to the least sensitive factor).…”

Optimization of flip-chip transitions for 60-GHz packages

“…However, a flipchip transition may induce more than 2 dB insertion loss, if not carefully designed. Previously a couple of design parameters that affect the electrical performance of the flip-chip transition have been analyzed at millimeter-wave frequencies [4], and more parameters have been included in analysis at 20 GHz [5]. In this paper we present a design methodology of the flip-chip transition for 60-GHz packages, based on a comprehensive sensitivity analysis.…”

A Passive Circuit Based RF Optimization Methodology for Wireless Sensor Network Nodes

“…There were lots of researches and publications focus on the characterization [3,4] of the above technologies. Characterization of the advanced packaging technologies was carried out and the material aspect properties were well studied.…”