Organic Packages With Embedded Phased-Array Antennas for 60-GHz Wireless Chipsets

Abstract

Abstract-Index Terms-60 GHz, antenna-in-package, millimeter-wave package, phased-array antennas.

Investigation of a photodefinable glass substrate for millimeter-wave radios on package

“…In [6], an alumina substrate was used, but that substrate only had one level of interconnect that enabled flip-chip die assembly without on-package antenna integration. Several organic substrate materials have been investigated including liquid crystal polymers (LCP) [7] and BT laminate [8], [9]. While LCP usually presents excellent electrical characteristics, e.g.…”

Optimization of flip-chip transitions for 60-GHz packages

“…Once each of these dimensions is set to its optimal value given the constraints, impedance matching circuits can be further implemented in the chip or on the package substrate to mitigate any remaining discontinuities. The proposed design methodology has had a pivotal role in the successful development of the world's first 60-GHz plastic package [3]. This paper presented a sensitivity analysis on the effect of design variables in a flip-chip transition.…”

“…While the current wireless local area network (WLAN) standard IEEE 802.11n has a maximum data rate of 600 Mb/s using a 40-MHz wide channel around 2.4/5 GHz, the IEEE 802.11ad standard provides up to 6.7 Gb/s per a 1.9-GHz wide channel around 60 GHz [1]. Advanced printed circuit board (PCB) materials such as low-temperature co-fired ceramic (LTCC) and liquid crystal polymer (LCP) have been used for 60-GHz packages to minimize feed loss [2,3]. These materials are costly, but their insertion loss is merely 1-2 dB lower than that of conventional FR-4 substrates depending on the feed length.…”

Optimization of a Flip-Chip Transition for Signal Integrity at 60-GHz Band

“…현재 WLAN의 주류를 이루고 있 는 IEEE 802.11n 표준이 2.4 또는 5 GHz 근처 40 MHz 대 역폭을 사용하여 최대 600 Mbps의 데이터 전송 속도를 내는 반면에, 802.11ad 표준은 60 GHz 근처 1.9 GHz 대역 폭을 사용해 6 Gbps 이상의 속도를 낼 수 있다 [1] . 60 GHz 모듈에는 안테나 피드의 삽입 손실을 줄이기 위해 liquid crystal polymer 같은 특수 플라스틱이나 세라믹 기판이 사용된다 [2], [3] . .…”