Design of Thermostat Controlled Electrical Heating Circuits on Manned Spacecraft

Zhang, Li; Fu, Yang; Tang, Zixin; Chen, Ling; Feng, Ming

doi:10.1088/1742-6596/2403/1/012010

Cited by 1 publication

(1 citation statement)

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“…Furthermore, the electrical heating method is a common active thermal control measure for systems used in low-temperature environments. [59] For example, the active heater (15.5 W) was used in satellite observation instruments to maintain the optical bench within the workable temperature range and meet the temperature stability requirements. [60] The power of such heaters used in spacecraft and satellites generally ranges from 7 W to 32 W. [60][61][62][63][64] In comparison, the power (6 W) of the EDA proposed in this work was slightly lower, suggesting that the EDA is promising for applications in low-temperature environments.…”

Section: Adhesion Performancementioning

confidence: 99%

Electrothermal Dry Adhesives with High Adhesion Under Low Temperatures Based on Tunable Stiffness

Zhang,

Tian,

Liu

et al. 2023

Adv Funct Materials

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Bioinspired dry adhesives relying on van der Waals interactions have shown great potential in object manipulation and climbing robots. Although substantial progress has been made in dry adhesives for extreme environments (such as vacuum and microgravity), robust adhesion at low temperatures, i.e., typical scenes in space or polar environments, is rarely achieved. Here, an electrothermal dry adhesive (EDA) based on tunable stiffness for low‐temperature environments is proposed, which can be reversibly transformed between the soft and rigid state in low‐temperature environments due to the electrothermal effect. The former is beneficial for conformal contact, while the latter is convenient for interfacial stress homogenization in the grasping stage. According to the adhesion strategy comprising soft contact followed by rigid gripping, the EDA demonstrates the adhesion of 1063 kPa at −90 °C, i.e., 1022 times higher than conventional polydimethylsiloxane (PDMS) adhesives. Moreover, the EDA requires an energy supply (6 W at −90 °C) only during pressing, subsequently changing to the rigid state with no power consumption, which requires relatively low electrical energy compared to continuous heating methods. Such adhesion strategy extends the workable temperature of dry adhesives to −90 °C, opening up a new avenue for developing dry adhesives for harsh environments.

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