Design of Nanoporous Polyarylene Polymers for Use as Low-k Dielectrics in Microelectronic Devices

Silvis, H. Craig; Bouck, Kevin J.; Godschalx, J. P.; Niu, Q. Jason; Radler, Michael J.; Stokich, T. M.; Kern, Brandon; Marshall, J.; Syverud, Karin; Leff, Mary

doi:10.1021/bk-2004-0874.ch014

Cited by 4 publications

(1 citation statement)

References 0 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…With SiLK™ from The Dow Chemical Company there is already an insulating material based on a polyphenylene structure with a dielectric constant of 2.65 commercially available 9. A further decrease in the dielectric constant can be achieved preparing an organic nanoporous structure from a thermally stable matrix and a porogen;11 the dielectric constant of the polyphenylene SiLK™ for example was reduced to a value of 2.3 with a star‐shaped polystyrene as porogen 12. Concerning this approach, hyperbranched polyphenylenes seem to be very promising as a matrix material since firstly, they should exhibit low dielectric constants due to their branched and twisted unpolar all‐phenylene structure,13 and secondly, due to the branching a high solubility and a miscibility with porogens can be expected.…”

Section: Introductionmentioning

confidence: 99%

Characterisation of Thin Composite Films from Hyperbranched Polyphenylene and Thermolabile Hyperbranched Polycarbonate

Stumpe¹,

Eichhorn²,

Voit³

2008

Macro Chemistry & Physics

View full text Add to dashboard Cite

Thin composite films made from a thermally stable hyperbranched polyphenylene and a thermolabile hyperbranched polycarbonate were prepared on silicon wafers and characterised. The end groups of the polycarbonate were varied in order to accomplish an optimised interaction between the two components and thus the formation of homogeneous blends. The composite films were annealed at 200 °C in order to decompose the hyperbranched polycarbonate which can act as a porogen. The composition of the films before and after the annealing process was investigated applying IR spectroscopy and spectroscopic ellipsometry. Analysis of the data allowed calculating the volume fractions of the two materials within the films.

show abstract

Section: Introductionmentioning

confidence: 99%

Characterisation of Thin Composite Films from Hyperbranched Polyphenylene and Thermolabile Hyperbranched Polycarbonate

Stumpe¹,

Eichhorn²,

Voit³

2008

Macro Chemistry & Physics

View full text Add to dashboard Cite

show abstract

Characterization of low pressure chemical vapor deposited polymeric fluorinated carbon m (C:FX)n thin films with low dielectric constant

Rastogi

Desu

2006

Appl. Phys. A

View full text Add to dashboard Cite

Control of pore size in epoxy systems.

Sawyer¹,

Lenhart

Lee

et al. 2009

View full text Add to dashboard Cite

Both conventional and combinatorial approaches were used to study the pore formation process in epoxy based polymer systems. Sandia National Laboratories conducted the initial work and collaborated with North Dakota State University (NDSU) using a combinatorial research approach to produce a library of novel monomers and crosslinkers capable of forming porous polymers. The library was screened to determine the physical factors that control porosity, such as porogen loading, polymer-porogen interactions, and polymer crosslink density. We have identified the physical and chemical factors that control the average porosity, pore size, and pore size distribution within epoxy based systems. 5 CONTENTS

show abstract

Design of Nanoporous Polyarylene Polymers for Use as Low-k Dielectrics in Microelectronic Devices

Cited by 4 publications

References 0 publications

Characterisation of Thin Composite Films from Hyperbranched Polyphenylene and Thermolabile Hyperbranched Polycarbonate

Characterisation of Thin Composite Films from Hyperbranched Polyphenylene and Thermolabile Hyperbranched Polycarbonate

Characterization of low pressure chemical vapor deposited polymeric fluorinated carbon m (C:FX)n thin films with low dielectric constant

Control of pore size in epoxy systems.

Contact Info

Product

Resources

About