Design of bossed silicon membranes for high sensitivity microphone applications

Martins, Paulo Sérgio; Beclin, S.; Brida, S.; Metivet, S.; Stojanovic, O.; Malhaire, C.

doi:10.1007/s00542-006-0347-0

Cited by 10 publications

(5 citation statements)

References 2 publications

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“…Capacitive pressure sensors have advantages in their high pressure sensitivity (Lee and Wise 1982b;Clark and Wise 1979), low temperature sensitivity (Chau and Wise 1987;Sander et al 1980), and low power consumption (Chavan and Wise 2001) compared with the more established piezoresistive sensors. Nevertheless, the change in capacitance is normally non-linear with pressure (Blazquez et al 1989) unless a bossed diaphragm (Etouhami et al 2004;Martins et al 2007;Moe et al 2000;Sandmaier and Kuhl 1993) or a contact mode (touching electrodes) (Cho et al 1990) is used for linearization. Furthermore, stray capacitance (Frobenius et al 1973) and complicated signal processing circuitry are two major disadvantages of the capacitive sensors (Gopel et al 1994).…”

Section: Introductionmentioning

confidence: 99%

A hybrid capacitive pressure and temperature sensor fabricated by adhesive bonding technique for harsh environment of kraft pulp digesters

2010

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We have developed a compensated capacitive pressure and temperature sensor for kraft pulp digesters (pH 13.5, temperatures 25-175°C reaching a local maximum of 180°C and pressures up to 2 MPa). The gauge capacitive pressure sensor was fabricated by bonding silicon and Pyrex chips using a high temperature, low viscosity UV (ultraviolent) adhesive as the gap-controlling layer and heat curing adhesive as the bonding agent. A simple chip bonding technique, involving insertion of the adhesive into the gap between two chips was developed. A platinum thin-film wire was patterned on top of a silicon chip to form a resistance temperature detector (RTD) with a nominal resistance of 1,500 X. A silicon dioxide layer and a thin layer of Parylene were deposited to passivate the pressure sensor diaphragm and the sensors were embedded into epoxy for protection against the caustic environment in kraft digesters. The sensors were tested up to 2 MPa and 170°C in an environment chamber. The maximum thermal error of ±1% (absolute value of ±20 kPa) full scale output (FSO) and an average sensitivity of 0.554 fF/kPa were measured. Parylene-coated silicon chips were tested for a full kraft pulping cycle with no signs of corrosion.

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Section: Introductionmentioning

confidence: 99%

A hybrid capacitive pressure and temperature sensor fabricated by adhesive bonding technique for harsh environment of kraft pulp digesters

2010

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“…This type of wafer substrate is very expensive, involving costly reactive ion etching process development. 16 A piezoelectricbased ultrasonic transducer was developed using 25-µmthick polyimide membrane on silicon substrate. 17 Design and numerical analysis of a capacitive type microphone was studied.…”

Section: Introductionmentioning

confidence: 99%

A Low-Cost Fabrication and Numerical Simulation of a MEMS Acoustic Transducer Using Polyimide Membrane on FR4 Substrate

Karthikeyan¹,

Sujatha²,

Sundar³

2021

J. Electron. Mater.

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Micro-electromechanical system (MEMS)-based acoustic transducers are also known as microphones. The membrane materials on MEMS microphones are metal, polysilicon, silicon, and silicon nitride. The existing technology and materials used for the microphones involve expensive materials and complex process steps. This paper proposed a low-cost fabrication process and studies a MEMS acoustic transducer device using polyimide as a membrane on FR4 substrate (non-silicon substrate). The numerical simulation is carried out for the proposed device and considers the following parameters such as thickness of membrane, diameter of diaphragm cavity, resistor length and applied pressure. This device has four resistors which are linked in the method of Wheatstone bridge. The resistance change is observed due to membrane deformation when applying pressure, and output is measured on corresponding nodes. Based on the operating parameters studied the change in resistance, displacement, frequency response, sensitivity and operating bandwidth.

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“…However, with the downscaling, accurate measurement of mechanical properties becomes a hot challenge especially since these properties may depend on the fabrication process. This may have consequences on MEMS performances and reliability [1][2][3]. Furthermore, architectures are more and more complex such as multilayers which make the determination of mechanical properties more difficult for each constituent material.…”

Section: Introductionmentioning

confidence: 99%

On the determination of Poisson’s ratio of stressed monolayer and bilayer submicron thick films

Martins

Malhaire

Brida³

et al. 2009

Microsyst Technol

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In this paper, the bulge test is used to determine the mechanical properties of very thin dielectric membranes. Commonly, this experimental method permits to determine the residual stress (r 0 ) and biaxial Young's modulus (E/(1 -t)). Associating square and rectangular membranes with different length to width ratios, the Poisson's ratio (t) can also be determined. LPCVD Si 3 N 4 monolayer and Si 3 N 4 /SiO 2 bilayer membranes, with thicknesses down to 100 nm, have been characterized giving results in agreement with literature for Si 3 N 4 , E = 212 ± 14 GPa, r 0 = 420 ± 8 MPa and t = 0.29.

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Design of bossed silicon membranes for high sensitivity microphone applications

Cited by 10 publications

References 2 publications

A hybrid capacitive pressure and temperature sensor fabricated by adhesive bonding technique for harsh environment of kraft pulp digesters

A hybrid capacitive pressure and temperature sensor fabricated by adhesive bonding technique for harsh environment of kraft pulp digesters

A Low-Cost Fabrication and Numerical Simulation of a MEMS Acoustic Transducer Using Polyimide Membrane on FR4 Substrate

On the determination of Poisson’s ratio of stressed monolayer and bilayer submicron thick films

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