Design of an experimental study of high through-plane thermal conductivity hybrid epoxy composite insulation with superior dielectric strength

Nguyen, Hiep H.; Konstantinou, Antigoni; Wang, Yifei; Ronzello, JoAnne; Davis, Kerry; Cao, Yang

doi:10.1039/d2ma00592a

Cited by 7 publications

(6 citation statements)

References 54 publications

(89 reference statements)

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“…Using design of experiments (DOE), Nguyen et al [ 131 ] investigated the effects of factors on the TC of hybrid epoxy composites consisting of BN clusters, talc nanoclay and ZnO particles. A statistical model based on the component compositions was developed for the TC of the composites, with an R-squared of 98.17 %.…”

Section: Through-plane Thermal Conductivity (Tptc) Of Polymer Composi...mentioning

confidence: 99%

See 1 more Smart Citation

Fillers and methods to improve the effective (out-plane) thermal conductivity of polymeric thermal interface materials – A review

Mumtaz,

Li,

Artiaga

et al. 2024

Heliyon

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Section: Through-plane Thermal Conductivity (Tptc) Of Polymer Composi...mentioning

confidence: 99%

“…The improved TC value could reach 1.3 W m −1 K −1 , i.e., 6 times higher than that of pure epoxy resin, while retaining outstanding dielectric characteristics. The results of DOE analysis can be used for the composition of polymer composites [ 131 ].…”

Section: Through-plane Thermal Conductivity (Tptc) Of Polymer Composi...mentioning

confidence: 99%

Fillers and methods to improve the effective (out-plane) thermal conductivity of polymeric thermal interface materials – A review

Mumtaz,

Li,

Artiaga

et al. 2024

Heliyon

View full text Add to dashboard Cite

“…Using the design of experiments (DOE) method, Nguyen et al [115] researched on the effects of factors on TC of hybrid epoxy composites comprising BN clusters, talc nanoclay and ZnO particles. A statistical model based on the component compositions was developed for the TC of composites, with an R-squared of 98.17%.…”

Section: Mixture Of Different Types Of Fillersmentioning

confidence: 99%

Fillers and Methods to Improve the Effective (Out-Plane) Thermal Conductivity of Polymeric Thermal Interface Materials—A Review

Mumtaz,

Farooq

et al. 2023

Preprint

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The internet of things and growing demand for smaller and advanced devices has created the problem of high heat production in the electronic equipment which greatly reduces the work performance and life of the electronic instruments. Thermal interface materials (TIMs) are placed in between heat generating micro-chip and the heat dissipater to conduct all the produced heat to the heat sink. Development of suitable TIMs with excellent thermal conductivity (TC) in both in-plane and through-plane directions is a very important need at present. For efficient thermal management, polymer composites are potential candidates. But in general their thermal conductivity is low compared to that of metals. The filler integration into the polymer matrix is one of the two approaches used to increase the thermal conductivity of polymer composites and is also easy to scale up for industrial production. Another way to achieve this is to change the structure of polymer chains, which fall out of the scope of this work. In this review, considering the first approach, the authors have summarized recent development in many types of fillers with different scenarios by providing multiple cases with successful strategies to improve through-plane thermal conductivity (TPTC) (K⊥). For better understanding of TC the comprehensive background is also presented. In the end, it is given a detailed conclusion which provides drawbacks of some filler, multiple significant routes recommended by other researchers to build Thermally Conductive Polymer Composites, future aspects along with direction so that the researchers can get a guideline to design an effective polymer based Thermal interface materials. A number of methods to improve the effective (out-plane) thermal conductivity of polymer composites are also discussed.

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“…Saeedi et al have proposed a low dielectric-loss EP system based on the testing of electrical properties [9]. Nguyen et al have obtained EP composites with low dielectric losses using the design of experiment approaches [10]. Wu et al optimized the dielectric loss of composites by improving the synthesis process [11,12].…”

Section: Introductionmentioning

confidence: 99%

Computationally driven design of low dielectric-loss epoxy resin for medium-frequency transformers

Fan

Zhao

et al. 2023

J. Phys. D: Appl. Phys.

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The design of low dielectric loss epoxy resin (EP) systems plays an important role in the insulation optimization of medium-frequency transformers (MFTs). Due to the diversity of EP and curing agents, the traditional design method inspired by dielectric-loss measurements cannot reduce the low dielectric-losses of EP system designs from plentiful candidate EP systems. In this study, molecular dynamic (MD) computations were introduced to drive the design of a low dielectric-loss EP system for MFTs. By analyzing the relationship between dielectric loss and molecular motion of EP systems, two MD results were selected as descriptors for indicating the dielectric loss of EP systems, including mean square displacement and α-transition temperature. Eventually, a low dielectric-loss EP system blending EP, methyl tetrahydrophthalic anhydride, and dodecenyl succinic anhydride was effectively designed according to the descriptors. The rationality of the computation-driven design was verified by broadband dielectric spectroscopy measurements and finite element method. Compared with previous EP systems, MFT insulated with the designed EP system had not only a 40% lower dielectric loss (9.79 W) but a higher overload capacity. This study provides an effective method for the design of low dielectric-loss EP systems.

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Design of an experimental study of high through-plane thermal conductivity hybrid epoxy composite insulation with superior dielectric strength

Abstract: Thermally conductive polymers are highly desired as electrical insulation material in power-electronic and electrical machines towards high power density and payload efficiencies. This paper investigates the thermal conductivity of hybrid...

Cited by 7 publications

References 54 publications

Fillers and methods to improve the effective (out-plane) thermal conductivity of polymeric thermal interface materials – A review

Fillers and methods to improve the effective (out-plane) thermal conductivity of polymeric thermal interface materials – A review

Fillers and Methods to Improve the Effective (Out-Plane) Thermal Conductivity of Polymeric Thermal Interface Materials—A Review

Computationally driven design of low dielectric-loss epoxy resin for medium-frequency transformers

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