Fillers and Methods to Improve the Effective (Out-Plane) Thermal Conductivity of Polymeric Thermal Interface Materials—A Review

Abstract

The internet of things and growing demand for smaller and advanced devices has created the problem of high heat production in the electronic equipment which greatly reduces the work performance and life of the electronic instruments. Thermal interface materials (TIMs) are placed in between heat generating micro-chip and the heat dissipater to conduct all the produced heat to the heat sink. Development of suitable TIMs with excellent thermal conductivity (TC) in both in-plane and through-plane directions is a very important need at present. For efficient thermal management, polymer composites are potential candidates. But in general their thermal conductivity is low compared to that of metals. The filler integration into the polymer matrix is one of the two approaches used to increase the thermal conductivity of polymer composites and is also easy to scale up for industrial production. Another way to achieve this is to change the structure of polymer chains, which fall out of the scope of this work. In this review, considering the first approach, the authors have summarized recent development in many types of fillers with different scenarios by providing multiple cases with successful strategies to improve through-plane thermal conductivity (TPTC) (K⊥). For better understanding of TC the comprehensive background is also presented. In the end, it is given a detailed conclusion which provides drawbacks of some filler, multiple significant routes recommended by other researchers to build Thermally Conductive Polymer Composites, future aspects along with direction so that the researchers can get a guideline to design an effective polymer based Thermal interface materials. A number of methods to improve the effective (out-plane) thermal conductivity of polymer composites are also discussed.