2016
DOI: 10.1016/j.sna.2016.04.040
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Design, fabrication and characterization of thin film resistances for heat flux sensing application

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Cited by 52 publications
(24 citation statements)
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“…We observed a decrease down to 200°C, then an increase. This phenomenon was also reported by Schmid and Seidel [10] and Zribi et al [12] on a Pt/Ti and Pt/Cr film respectively. On the other hand, Johnson only reported a decrease in resistivity on a Ni film without sublayer.…”
Section: Characteristics Of the Sensor With Annealingsupporting
confidence: 82%
See 1 more Smart Citation
“…We observed a decrease down to 200°C, then an increase. This phenomenon was also reported by Schmid and Seidel [10] and Zribi et al [12] on a Pt/Ti and Pt/Cr film respectively. On the other hand, Johnson only reported a decrease in resistivity on a Ni film without sublayer.…”
Section: Characteristics Of the Sensor With Annealingsupporting
confidence: 82%
“…The total sensor dimensions are 5 x 5 x 0.5 mm 3 , with a sensing area of 2 x 2 mm 2 . More details on the sensor can be found in previous works where platinum RTDs were used [12]. The properties of the materials used in the sensor are summarized in Table 1.…”
Section: Design and Fabricationmentioning
confidence: 99%
“…This maximum temperature was then held for 60 min, followed by a free cooling stage to room temperature again. At this annealing temperature, thin films suffered several structural and microstructural changes, such as grain growth, recrystallization and structural refinement, among others [19].…”
Section: Thin Film Preparationmentioning
confidence: 99%
“…When the thin film thickness (d s ) is known by a separate measurement, such as SEM, the thermal diffusivity of the thin film (α s ) can be determined, which characterizes the time-dependent heat distribution in the film, and when the thermal effusivity of the substrate (e b ) is known by separate measurement, the effusivity (e s ) of the thin film can be determined. The thermal effusivity (e = √ kρc) controls the transient surface heating processes, the heat transition at the interface between different materials, and is of fundamental importance for the heat propagation across layer systems [19]. Once the thermal diffusivity and effusivity are known, the thermal conductivity k s = e s √ α s and volume heat capacity (ρc) s = e s / √ α s of the thin film can be calculated, with ρ being the mass density and c the specific heat capacity [24].…”
Section: Thermal Propertiesmentioning
confidence: 99%
“…In this paper, a Pt RTD was fabricated using microfabrication lithographic methods. Pt RTDs were previously reported in gas [ 28 ] and heat [ 29 ] flow devices. Pt was chosen due to its biocompatibility and linear behavior with temperature variations within the proposed temperature range [ 30 ].…”
Section: Introductionmentioning
confidence: 99%