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This paper presents the development of metallic thermoresistive thin film, providing an innovative solution to dynamically control the temperature during the injection molding process of polymeric parts. The general idea was to tailor the signal response of the nitrogen- and oxygen-doped titanium-copper thin film (TiCu(N,O))-based transducers, in order to optimize their use in temperature sensor devices. The results reveal that the nitrogen or oxygen doping level has an evident effect on the thermoresistive response of TiCu(N,O) films. The temperature coefficient of resistance values reached 2.29 × 10−2 °C−1, which was almost six times higher than the traditional platinum-based sensors. In order to demonstrate the sensing capabilities of thin films, a proof-of-concept experiment was carried out, integrating the developed TiCu(N,O) films with the best response in an injection steel mold, connected to a data acquisition system. These novel sensor inserts proved to be sensitive to the temperature evolution during the injection process, directly in contact with the polymer melt in the mold, demonstrating their possible use in real operation devices where temperature profiles are a major parameter, such as the injection molding process of polymeric parts.

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We argue that the face‐centered cubic (fcc) polymeric C60 phase obtained at 9.5 GPa can be mapped onto the classical frustrated Ising fcc antiferromagnet. Extensive density functional theory (DFT) calculations show that at 9.5 GPa 56/65 2+2 cycloaddition polymeric bonds are formed between neighboring molecules having different standard orientations but do not form when they have the same standard orientation. These “antiferromagnetic” bonds cannot be fully satisfied in the fcc lattice of the polymeric phase, resulting in a frustrated structure. By analyzing the ground state configurations of the frustrated Ising fcc antiferromagnet, a picture of the polymeric frustrated structure was obtained.