2020 23rd Euromicro Conference on Digital System Design (DSD) 2020
DOI: 10.1109/dsd51259.2020.00101
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Design Concept for Radiation-Hardening of Triple Modular Redundancy TSPC Flip-Flops

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Cited by 3 publications
(2 citation statements)
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“…Baseline flip-flops are implemented as standard cell gates in IHP's 130 nm technology and compared to the available standard D-flip-flop which is present in the unhardened standard cell library. As published in [65], a TSPC flip-flop candidate is nearly twice as fast as the reference D-flip-flop and saves 41 % of the silicon area.…”
Section: B Tspc-tmr Flip-flopmentioning
confidence: 99%
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“…Baseline flip-flops are implemented as standard cell gates in IHP's 130 nm technology and compared to the available standard D-flip-flop which is present in the unhardened standard cell library. As published in [65], a TSPC flip-flop candidate is nearly twice as fast as the reference D-flip-flop and saves 41 % of the silicon area.…”
Section: B Tspc-tmr Flip-flopmentioning
confidence: 99%
“…Finally, the output signal needs to be negated by an output inverter. As published in [65], the TSPC-TMR arrangement requires only 130 ps more than a single standard reference D-flip-flop under worst case condition, based on post layout extracted propagation delays. Finally, a normalized overhead of only 5.8 for the area, 7.4 for the energy, and a slight improvement in terms of propagation delay t pg of 0.9 can be obtained in comparison to the baseline, unhardened standard D-flip-flop DFF_STD (see Table I).…”
Section: B Tspc-tmr Flip-flopmentioning
confidence: 99%