Design challenges for high-performance heat sinks used in microelectronic equipment: evolution and future requirements

Rodgers, Peter; Eveloy, Valérie

doi:10.1109/esime.2004.1304087

Cited by 7 publications

(4 citation statements)

References 16 publications

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“…The flow re-circulates at the back of the ligament. The geometric complexity and the random orientation of the foam solid materials make the solutions of the governing transport equations of the pores difficult [14][15][16][17][18].…”

Section: Introductionmentioning

confidence: 99%

Thermal performance of an innovative heat sink using metallic foams and aluminum nanoparticles—Experimental study

Lotfizadeh

Mehrizi

Motlagh

et al. 2015

International Communications in Heat and Mass Transfer

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Section: Introductionmentioning

confidence: 99%

Thermal performance of an innovative heat sink using metallic foams and aluminum nanoparticles—Experimental study

Lotfizadeh

Mehrizi

Motlagh

et al. 2015

International Communications in Heat and Mass Transfer

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“…Moreover the design of essential components of the system (e.g. heat-sink and PCB) will be highly affected by these constraints [9]. These directly translate into additional costs [10].…”

Section: Introductionmentioning

confidence: 99%

Temperature variation aware multi-scale delay, power and thermal analysis at RT and gate level

2015

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“…They promote the heat dissipation by extending the surface area through the use of fins. Their design and analysis is one of the most extensive research areas in electronics cooling . Some of the main research areas include the minimization of interfacial contact thermal resistance and the improvement of heat spreading technologies.…”

Section: Introductionmentioning

confidence: 99%

“…Their design and analysis is one of the most extensive research areas in electronics cooling. 11 Some of the main research areas include the minimization of interfacial contact thermal resistance and the improvement of heat spreading technologies. Nakayama and Bergles 12 found that the component to heat sink interfacial contact thermal resistance can be comparable to the actual heat sink thermal resistance.…”

Section: ■ Introductionmentioning

confidence: 99%

Study on Liquid Crystal Polymer-Hexagonal Boron Nitride Composites for Hybrid Heat Sinks

Leung

Khan

Shi³

et al. 2013

Ind. Eng. Chem. Res.

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Designers of electronic devices and telecommunications equipment have used different methods (e.g., three-dimensional chip architecture, comprised of a vertically integrated stack of chips) to increase the number of transistors on integrated circuits. These latest chips generate excessive amounts of heat and thus can reach unacceptably high temperatures. In this context, this research aims to develop thermally conductive liquid crystal polymer (LCP)-hexagonal boron nitride (hBN) composite films to replace the traditionally used Kapton films that satisfy the electrical insulation requirements for the attachment of heat sinks to the chips without compromising the heat dissipation performance. Experimental simulations show that the maximum temperature of the heater mounted with a hybrid heat sink reduced with increased hBN content. Furthermore, a sufficient slow cooling process in the fabrication stage of the LCP/hBN composite films promotes the fibrillation of LCP matrix, leading to highly ordered structure and promoted the composite’s heat dissipation ability.

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Design challenges for high-performance heat sinks used in microelectronic equipment: evolution and future requirements

Cited by 7 publications

References 16 publications

Thermal performance of an innovative heat sink using metallic foams and aluminum nanoparticles—Experimental study

Thermal performance of an innovative heat sink using metallic foams and aluminum nanoparticles—Experimental study

Temperature variation aware multi-scale delay, power and thermal analysis at RT and gate level

Study on Liquid Crystal Polymer-Hexagonal Boron Nitride Composites for Hybrid Heat Sinks

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