Study on Liquid Crystal Polymer-Hexagonal Boron Nitride Composites for Hybrid Heat Sinks

Abstract

Designers of electronic devices and telecommunications equipment have used different methods (e.g., three-dimensional chip architecture, comprised of a vertically integrated stack of chips) to increase the number of transistors on integrated circuits. These latest chips generate excessive amounts of heat and thus can reach unacceptably high temperatures. In this context, this research aims to develop thermally conductive liquid crystal polymer (LCP)-hexagonal boron nitride (hBN) composite films to replace the traditionally used Kapton films that satisfy the electrical insulation requirements for the attachment of heat sinks to the chips without compromising the heat dissipation performance. Experimental simulations show that the maximum temperature of the heater mounted with a hybrid heat sink reduced with increased hBN content. Furthermore, a sufficient slow cooling process in the fabrication stage of the LCP/hBN composite films promotes the fibrillation of LCP matrix, leading to highly ordered structure and promoted the composite’s heat dissipation ability.

Highly dispersible laser activate particles via surface modification for laser direct structuring and electroless plating application

“…High-performance engineering plastics, or ''super engineering plastics'' (SEPs) such as polyphenylene sulfide (PPS), liquid crystalline polymers (LCPs), and polyetherimide (PEI) have been widely studied and applied. [5][6][7] Among SEP applications, three-dimensional (3D) circuit carriers offer enormous potential to simultaneously enhance the functionality and decrease the overall size of electronic systems. These 3D-molded interconnect devices (3D-MIDs) are manufactured by injection molding and structuring of 3D circuitry.…”

Tailor Made Conductivities of Polymer Matrix for Thermal Management: Design and Development of Three-Dimensional Carbonaceous Nanostructures

“…Their phonon scattering, however, increases the thermal conductivity, and thus, they has been widely used as heat sink material for safe thermal management in electronics. 5,10,11 However, the critical challenge to increase the thermal conductivity of a composite involves higher loading of thermal interface materials, which however generally jeopardizes the mechanical properties of the composites. 12,13 The higher loading of filler is also expected to increase the electrical conductivity of the composite.…”

“…The metal nitrides/carbides or diamond has a wide bandgap due to their crystal structures and exhibits high electrical insulation. Their phonon scattering, however, increases the thermal conductivity, and thus, they has been widely used as heat sink material for safe thermal management in electronics. ,, However, the critical challenge to increase the thermal conductivity of a composite involves higher loading of thermal interface materials, which however generally jeopardizes the mechanical properties of the composites. , The higher loading of filler is also expected to increase the electrical conductivity of the composite. It is thus required to understand first the thermal conduction mechanism in a polymer/resin based nanocomposite and it is a necessity to design and fabricate the novel nanohybrid morphologies in the matrix to enhance thermal conductivity and strength …”

Design of thermal hybrid composites based on liquid crystal polymer and hexagonal boron nitride fiber network in polylactide matrix

“…We have shown in our previous studies that we can develop thermal composites by individually mixing hexagonal boron nitride (hBN) in liquid crystal polymer (LCP) or PLA polymer matrices which has increased the thermal conductivity. However, if we can reach the proper alignments of hBN into the polymer matrix instead of the random dispersion of these micro fillers that will further increase the effective thermal conductivities of the composites while maintaining the mechanical properties.…”