Design-based thermal simulation methodology for ball grid array packages

Johnson, Z.; Eyman, M.

doi:10.1109/itherm.1998.689523

Cited by 13 publications

(6 citation statements)

References 3 publications

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“…Historically, the technique was first published by Johnson, et al [8][9], and later expanded to include organic substrate packages by others [10]. The technique has been shown to provide close agreement with experimental measurements.…”

Section: Sub/global Model Methodologymentioning

confidence: 99%

Effective Thermal Conductivity of Six Sigma’s Copper Reinforced Column Grid Array Interconnect for Ceramic Microelectronic Packages

Eblen

2010

2010 14th International Heat Transfer Conference, Volume 3

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Thermal management of flip chip style integrated circuits often relies on thermal conduction through the ceramic package and high lead solder grid array leads into the printed wiring board as the primary path for heat removal. Thermal analysis of this package configuration requires accurate characterization of the sometimes geometrically complex package-to-board interface. Given the unique structure of the Six Sigma column grid array (CGA) interconnect, a detailed finite element submodel was used to numerically derive the effective thermal conductivity with comparisons to a conventional CGA interconnect. Once an effective thermal conductivity value is obtained, the entire interconnect layer can be represented as a fictitious cuboid layer for inclusion in a more traditional “closed-form” thermal resistance calculation. This method allows the package designer a quick and robust method to evaluate initial thermal design study tradeoffs.

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Section: Sub/global Model Methodologymentioning

confidence: 99%

Effective Thermal Conductivity of Six Sigma’s Copper Reinforced Column Grid Array Interconnect for Ceramic Microelectronic Packages

Eblen

2010

2010 14th International Heat Transfer Conference, Volume 3

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“…As for the solder bumps and solder balls based on thermal submodel, solder balls and solder bumps are simplified and modeled as simple cuboids with equivalent thermal conductivity to reduce the simulation time [20], [21]. Through iterative process, the estimated effective thermal conductivity of cuboids representing solder bumps and solder balls are 36 W/m ·°C and 50 W/m ·°C, respectively.…”

Section: A Package Descriptionmentioning

confidence: 99%

Study of Response Surface Methodology in Thermal Optimization Design of Multichip Modules

Zhang

2013

IEEE Trans. Compon., Packag. Manufact. Technol.

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A 3-D model of multichip module (MCM) is built with ANSYS and the temperature field distribution is studied. A regression equation describing the relationship of structure parameters and material properties with the maximum chip junction temperature of MCM is made, which integrates the response surface methodology and ANSYS. Quantitative analysis of the effect of four design parameters on the maximum chip junction temperature of MCM is studied. The four design parameters are the thickness of the substrate, thermal conductivity of the substrate, thermal conductivity of the thermal grease, and convection heat transfer coefficient, respectively. The accuracy and validity of the regression equation are validated by simulation with ANSYS. In addition, the maximum error between the calculation value of the regression equation and the simulation value with ANSYS is 0.541°C. With the regression equation, the thermal optimization design results of the four parameters are K t g = 5 W/m°C, δ = 2.5 mm, K s = 290 W/m°C, and h = 55 W/m 2°C , which lead to the maximum chip junction temperature T j max = 89.172°C as the minimum value. Index Terms-ANSYS, multichip module (MCM), optimization design, response surface methodology (RSM).

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“…Thermal vias region in the PCB was represented by the "thermal submodel" to calculate the effective thermal conductivity, as suggested by Johnson and Eyman. 5 A systematic grid resolution study was performed, in order to select a grid structure capturing accurately the physics of the problem, yet not too detailed to avoid excessive computational times. The first selected grid was 84×159×79 with uniform grids in x, y and z directions, respectively.…”

Section: Modelingmentioning

confidence: 99%

Thermal Strategy for Modeling the Wirebonded Pbga Packages

Chiriac

Lee

1999

Journal of Electronics Manufacturing

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The Plastic Ball Grid Array (PBGA) package attracts considerable interest, being one of the most promising packaging technologies of the moment. Thermal analysis of a package and a Printed Circuit Board (PCB) stack-up is performed for a better understanding of package constitutive elements, allowing an enhanced thermal coupling of package and board for cost effective thermal management. A commercial Computational Fluid Dynamics (CFD) software was applied for thermal simulation. The study focuses on detailed thermal modeling of a 256 Wirebonded PBGA (depopulated bump array) package in a natural convection setup. The model was refined to include all the features, and the calculated junction-toambient thermal resistance for each simulation was compared to available experimental data. The order of creating the internal structures in the model has a strong impact on the package thermal characteristics. The calculated errors varied from 5% (detailed model) to 43% (simplified model).

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Design-based thermal simulation methodology for ball grid array packages

Cited by 13 publications

References 3 publications

Effective Thermal Conductivity of Six Sigma’s Copper Reinforced Column Grid Array Interconnect for Ceramic Microelectronic Packages

Effective Thermal Conductivity of Six Sigma’s Copper Reinforced Column Grid Array Interconnect for Ceramic Microelectronic Packages

Study of Response Surface Methodology in Thermal Optimization Design of Multichip Modules

Thermal Strategy for Modeling the Wirebonded Pbga Packages

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