Design automation methodology and rf/analog modeling for rf CMOS and SiGe BiCMOS technologies

Abstract

The rapidly expanding telecommunications market has led to a need for advanced rf integrated circuits. Complex rf-and mixed-signal system-on-chip designs require accurate prediction early in the design schedule, and time-to-market pressures dictate that design iterations be kept to a minimum. Signal integrity is seen as a key issue in typical applications, requiring very accurate interconnect transmission-line modeling and RLC extraction of parasitic effects. To enable this, IBM has in place a mature project infrastructure consisting of predictive device models, complete rf characterization, statistical and scalable compact models that are hardware-verified, and a robust design automation environment. Finally, the unit and integration testing of all of these components is performed thoroughly. This paper describes each of these aspects and provides an overview of associated development work.

Wireless Transceiver Systems Design

“…Note that MOP behavioral modeling requires a mature SOP characterization and modeling approach in place, on which it can build upon further, e.g., [Harame03]. First, local approximation or linearization techniques will likely not work anymore in the MOP case.…”

High-frequency simulations and compact models compared with measurements for passive on-chip components

“…In the development of TCAD software the design, implementation and characterization of teststructures is very crucial. The sophisticated selection of the appropriate devices combined with advanced measurement techniques allows accurate benchmarking with the resulting tools [15].…”

A SiGe BiCMOS linear regulator with wideband, high power supply rejection

“…Either CMOS transistors or SiGe HBTs can be used for mixed-signal components, and SiGe HBTs for Radio Frequency (RF) functions, facilitating the large scale integration of communication systems [1]. Advantages of CMOS technology are low power consumption, high linearity and high packaging density.…”