2010
DOI: 10.1016/j.sna.2009.11.023
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Design and verification of a thermoelectric energy harvester with stacked polysilicon thermocouples by CMOS process

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Cited by 47 publications
(22 citation statements)
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“…The power factor is an order smaller than this work, and the additional etching process requires a modified CMOS process and thus may jeopardize the process stability. A CMOS TEG based on co-planar thermocouple design has improved the power factor to 0.0417 W/cm 2 K 2 [2] and the most recent CMOS TEG design based on stacked poly-silicon thermocouples can deliver 0.0427 W/cm 2 K 2 [3]. This work based on quantum well-like thermocouples achieves the best performance and it is also CMOS compatible.…”
Section: Ers Teg Of Various Thermocouple Sizes Is Listed Inmentioning
confidence: 99%
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“…The power factor is an order smaller than this work, and the additional etching process requires a modified CMOS process and thus may jeopardize the process stability. A CMOS TEG based on co-planar thermocouple design has improved the power factor to 0.0417 W/cm 2 K 2 [2] and the most recent CMOS TEG design based on stacked poly-silicon thermocouples can deliver 0.0427 W/cm 2 K 2 [3]. This work based on quantum well-like thermocouples achieves the best performance and it is also CMOS compatible.…”
Section: Ers Teg Of Various Thermocouple Sizes Is Listed Inmentioning
confidence: 99%
“…Micro-thermoelectric generators (TEG) have been successfully developed by CMOS process [1][2][3], where silicon-based design has the advantage of using thin-film process in semiconductor infrastructure for batch production. This development is a major improvement over the previous works by electrochemical thickfilm deposition of V-VI thermoelectric compounds [4] and by thin-film deposition of polycrystalline silicon/germanium [5,6].…”
Section: Introductionmentioning
confidence: 99%
“…proposed a micro-thermoelectric generator (μTEG) design based on stacked polysilicon thermocouples, in which the p-and n-thermolegs of a thermocouple are stacked and insulated [32]. To analyze the optimal thermocouple size by matching their thermal resistance and electrical resistance a thermal model is applied.…”
Section: Thermoelectric Energymentioning
confidence: 99%
“…Therefore, we investigated in optimizing tools for thermoelectric devices. Different simulation approaches can be found in the current literature [2][3][4]. We implemented a numerical model and tested it against a finite element model.…”
Section: Introductionmentioning
confidence: 99%