2020
DOI: 10.1016/j.nima.2020.163710
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Design and realization of a sputter deposition system for the in situ and in operando use in polarized neutron reflectometry experiments: Novel capabilities

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Cited by 7 publications
(3 citation statements)
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“…We use direct current (d.c.) magnetron sputtering as described in refs. 46,50 . One of the three 2" sputter guns is loaded with a 6.3mm thick, 99.99% pure Cu sputter target and a second sputter gun is loaded with a 1.4mm thick 99.99% pure Ni target.…”
Section: Methodsmentioning
confidence: 99%
“…We use direct current (d.c.) magnetron sputtering as described in refs. 46,50 . One of the three 2" sputter guns is loaded with a 6.3mm thick, 99.99% pure Cu sputter target and a second sputter gun is loaded with a 1.4mm thick 99.99% pure Ni target.…”
Section: Methodsmentioning
confidence: 99%
“…A 45 nm thick Cu seed layer was grown on a 2 cm × 2 cm Si(001) substrate using DC magnetron sputtering in an ultrahigh-vacuum deposition chamber [17,18]. Subsequently, a 7 nm thick Fe thin film was added on the Cu layer in 28 deposition steps with a growth rate of approximately one monolayer of Fe per deposition step.…”
Section: Methodsmentioning
confidence: 99%
“…The sputtering system was also redesigned to improve the parameter control. This provides researchers with a highly versatile in situ deposition system, [ 56 ] as shown in Figure 3 . Furthermore, the development of a new control software allows the deposition process to be fully scripted and integrated with the beamline control into an automated measurement and deposition sequence.…”
Section: Recent Experimental Developmentsmentioning
confidence: 99%