2017
DOI: 10.1016/j.applthermaleng.2016.11.082
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Design and preparation of shape-stabilized composite phase change material with high thermal reliability via encapsulating polyethylene glycol into flower-like TiO2 nanostructure for thermal energy storage

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Cited by 64 publications
(20 citation statements)
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“…As shown in Figure 3, the volume and surface resistance of the films decreased gradually with increased nanofiller loading. The results suggested that although the volume resistance and surface resistance of the films decreased gradually, they were within the range of accepted properties for electronic packaging and/or electrical insulation material applications [26,[43][44][45][46][47][48]. The inset of Figure 3 shows the effects of four fillers on the flexural strength of the composites compared to the pure PVA matrix.…”
Section: Resultsmentioning
confidence: 77%
See 1 more Smart Citation
“…As shown in Figure 3, the volume and surface resistance of the films decreased gradually with increased nanofiller loading. The results suggested that although the volume resistance and surface resistance of the films decreased gradually, they were within the range of accepted properties for electronic packaging and/or electrical insulation material applications [26,[43][44][45][46][47][48]. The inset of Figure 3 shows the effects of four fillers on the flexural strength of the composites compared to the pure PVA matrix.…”
Section: Resultsmentioning
confidence: 77%
“…(GNS-MWCNT)@AgNPs/PVA flexible film specimens were successfully prepared by introducing the aforementioned structure into a polyvinyl alcohol (PVA) matrix. This combination microstructure was designed to provide an even greater opportunity to enhance λ due to a significantly higher intrinsic λ (about 3000 W/mK) of GNS and MWCNT [23][24][25][26][27][28][29][30] than that of other high-thermal conductivity ceramic fillers, such as aluminium nitride (AlN) and boron nitride (BN). Moreover, AgNPs were chosen because of their high thermal conductivity of Ag (λ = 429 W/(mK)) [6,24].…”
Section: Introductionmentioning
confidence: 99%
“…As shown in Figure 3, the volume and surface resistance of the films decreased gradually with increased nanofiller loading. The results suggested that although the volume resistance and surface resistance of the films decreased gradually, they were within the range of accepted properties for electronic packaging and/or electrical insulation material applications [26,[40][41][42][43][44][45]. The thermal conductivities of composites greatly depended on the properties of polymers and fillers, such as their content, components, and surface treatment of fillers [46][47][48][49][50].…”
Section: Resultsmentioning
confidence: 91%
“…(GNS-MWCNT)@AgNPs/PVA flexible film specimens were successfully prepared by introducing the aforementioned structure into a polyvinyl alcohol (PVA) matrix. This combination microstructure was designed to provide an even greater opportunity to enhance  due to the significantly higher intrinsic  (about 3000 W/mK) of GNS and MWCNT [23][24][25][26][27][28][29][30] than that of other high-thermal conductivity ceramic fillers, such as AlN and BN. Moreover, AgNPs were chosen because of theirs high thermal conductivity of Ag (λ = 429 W/(mK)) [6,24].…”
Section: Introductionmentioning
confidence: 99%
“…(GNS-MWCNT)@AgNPs/PVA flexible film specimens were successfully prepared by introducing the aforementioned structure into a polyvinyl alcohol (PVA) matrix. This combination microstructure was designed to provide an even greater opportunity to enhance  due to a significantly higher intrinsic  (about 3000 W/mK) of GNS and MWCNT [23][24][25][26][27][28][29][30] than that of other high-thermal conductivity ceramic fillers, such as aluminium nitride (AlN) and boron nitride (BN). Moreover, AgNPs were chosen because of their high thermal conductivity of Ag (λ = 429 W/(mK)) [6,24].…”
Section: Introductionmentioning
confidence: 99%