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2018
DOI: 10.1016/j.sna.2018.08.006
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Design and fabrication of SU-8 CMUT arrays through grayscale lithography

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Cited by 9 publications
(2 citation statements)
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“…As the fabrication process is relatively uniform, it is possible to integrate arrays with a high element density, small element size, MUT arrays, and external circuits in a chip for packaging. Currently, capacitive micromachined ultrasonic transducers (CMUTs) and piezoelectric micromachined ultrasonic transducers are being studied by an increasing number of research groups [10,11,12,13]. The deflection of the flexural mode of the piezoelectric micromachined ultrasonic transducer (PMUT) mainly depends on the lateral strain of its piezoelectric film while an AC voltage is applied [14,15,16].…”
Section: Introductionmentioning
confidence: 99%
“…As the fabrication process is relatively uniform, it is possible to integrate arrays with a high element density, small element size, MUT arrays, and external circuits in a chip for packaging. Currently, capacitive micromachined ultrasonic transducers (CMUTs) and piezoelectric micromachined ultrasonic transducers are being studied by an increasing number of research groups [10,11,12,13]. The deflection of the flexural mode of the piezoelectric micromachined ultrasonic transducer (PMUT) mainly depends on the lateral strain of its piezoelectric film while an AC voltage is applied [14,15,16].…”
Section: Introductionmentioning
confidence: 99%
“…When the SU-8 surface micromachining in Figure 1 is used to fabricate out-of-plane polymeric electrostatic MEMS structures, the use of sacrificial layers often generates an increased process complexity. To address this problem, the authors have previously developed and experimentally validated fabrication flows for out-of-plane SU-8 MEMS structures, based on grayscale lithography techniques, on both rigid substrates and flexible ones [20][21][22]. The developed methods do not use any sacrificial layers during the fabrication, removing four steps from traditional SU-8 surface micromachining for out-of-plane MEMS structures.…”
Section: Introductionmentioning
confidence: 99%