2017
DOI: 10.1088/1361-6439/aa6cd2
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Design and fabrication of a silicon-based MEMS acceleration switch working lower than 10 g

Abstract: This paper reports a low-g MEMS acceleration switch with threshold acceleration below 10 g. The proposed switch is made of single-crystalline silicon for high thermal stability and stressfree structure. A vertical operation type is adopted to enable fine control of the contact surface during the fabrication process. The switch contains displacement-restricting structures in all directions for impact resistance and is packaged with anodic bonding process. The fabricated switches had an average proof mass, initi… Show more

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Cited by 11 publications
(7 citation statements)
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References 14 publications
(18 reference statements)
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“…On the other hand, SOI technology can accurately control the structural thickness, thus reducing the threshold deviation caused by fabrication errors [19,70,71]. Hwang et al [70] reported a low-g switch based on SOI wafers. The designed and measured threshold values were 6.62 and 6.61 g, respectively.…”
Section: Low-g High-threshold-accuracy Inertial Micro-switchesmentioning
confidence: 99%
“…On the other hand, SOI technology can accurately control the structural thickness, thus reducing the threshold deviation caused by fabrication errors [19,70,71]. Hwang et al [70] reported a low-g switch based on SOI wafers. The designed and measured threshold values were 6.62 and 6.61 g, respectively.…”
Section: Low-g High-threshold-accuracy Inertial Micro-switchesmentioning
confidence: 99%
“…(1) Table 1 shows the values used in the numerical analysis. Those values are from the original design of the low-g MEMS acceleration switch [5] and the input force was set to 12 g (g is the gravitational acceleration). …”
Section: Analysis Methodsmentioning
confidence: 99%
“…The cold launch missiles which the main motor ignites after ejection, and the multi-stage rocket motors can prevent unexpected ignition if they use the acceleration signal as a safety condition. The proof mass of low-g MEMS acceleration switch developed by Kim's group (Figure 1) [5] moves in the z-direction to minimize the installation error. However, when using a MEMS acceleration switch in missiles, noise forces would act in the offaxis directions.…”
Section: Introductionmentioning
confidence: 99%
“…Field et al [ 61 ] studied a low-g switch with a threshold value of 25 g. The fabrication was based on a silicon-on-insulator (SOI) wafer, and the sensing direction was along the thickness of the wafer. Hwang et al [ 62 ] designed a low-g MEMS acceleration switch with a threshold acceleration of 6.61 g. The structural material was single-crystal silicon, the structure was stress-free, and the stability was good at high temperature. However, common SOI wafers have an unexpected disadvantage in that the balance of structure is hard to maintain, mainly due to over-etching by poor etching verticality, which causes quality deviation, shifts in the center of mass and the contact area becoming smaller, and the mass tilting or rotating when it moves along the shock direction, potentially leading to contact uncertainties.…”
Section: Intermittent Inertial Switchesmentioning
confidence: 99%