2013
DOI: 10.1109/tsm.2013.2238563
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Design and Fabrication of a Horn-Type Megasonic Waveguide for Nanoparticle Cleaning

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Cited by 10 publications
(5 citation statements)
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“…Furthermore, the radiation pressure ( ) induced by bubbles oscillation is one of the essential physical mechanisms for the bubble-driven particle motion in the abrasive phenomenon, which causes serious cavitation damage to the surface of hydraulic machinery [47] . In addition, radiation pressure is also an important mechanism for bubbles to remove pollutant particles in ultrasonic cleaning [12] , [13] , [14] , [15] . Therefore, it is necessary to carefully investigate the prediction accuracy of .…”
Section: Free Oscillating Bubble In Liquidsmentioning
confidence: 99%
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“…Furthermore, the radiation pressure ( ) induced by bubbles oscillation is one of the essential physical mechanisms for the bubble-driven particle motion in the abrasive phenomenon, which causes serious cavitation damage to the surface of hydraulic machinery [47] . In addition, radiation pressure is also an important mechanism for bubbles to remove pollutant particles in ultrasonic cleaning [12] , [13] , [14] , [15] . Therefore, it is necessary to carefully investigate the prediction accuracy of .…”
Section: Free Oscillating Bubble In Liquidsmentioning
confidence: 99%
“…Therefore, the compressibility effect is significant, which will lead to a large difference between the first-order and the second-order equations. Furthermore, and are essential for the investigations of the physical mechanism of practical applications, such as the cavitation damage [47] and the ultrasonic cleaning [12] , [13] , [14] , [15] . Therefore, when the bubble wall Mach number is high, the second-order equation should be safely selected for simulations due to its high accuracy.…”
Section: Influences Of the Initial Bubble Radiusmentioning
confidence: 99%
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“…Particulate residue is a major concern in IC, both owing to yield loss and owing to the failure to control defects; this limits product performance for the manufacturing of semiconductors [1]. However, through chemical solutions aided by sound fields (in the MHz range), particle removal can generally be achieved [2].…”
Section: Introductionmentioning
confidence: 99%
“…Single-wafer megasonic systems have been proposed for these reasons and they are regarded as one of major potential cleaning tools (3)(4)(5)(6). In megasonic cleaning, physical forces from a vibrating piezoelectric actuator are acting on contaminated particles with chemical activity in sub-micron size range (7).…”
Section: Introductionmentioning
confidence: 99%