1996
DOI: 10.1109/2944.577372
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Design and fabrication of 1.31-1.55-μm phased-array duplexer on InP

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Cited by 4 publications
(2 citation statements)
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“…2. The semiconductor wafer consisted of a 0.3 µm thick In 0.85 Ga 0.15 As 0.33 P 0.67 layer sandwiched between two 1.56 µm cladding layers of InP (Mestric et al 1996). The layers were grown on an InP substrate by metal-organic chemical vapor deposition (MOCVD).…”
Section: Waveguide Designmentioning
confidence: 99%
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“…2. The semiconductor wafer consisted of a 0.3 µm thick In 0.85 Ga 0.15 As 0.33 P 0.67 layer sandwiched between two 1.56 µm cladding layers of InP (Mestric et al 1996). The layers were grown on an InP substrate by metal-organic chemical vapor deposition (MOCVD).…”
Section: Waveguide Designmentioning
confidence: 99%
“…AWGs on InP are highly desirable because of their potential for monolithic integration with active devices such as lasers and amplifiers (Zirngibl et al 1992;Joyner et al 1994). The first broadband AWG on InP was designed for the duplexing of 1.31 µm and 1.55 µm wavelengths (Mestric et al 1996); however, the channel spacing is not suitable for CWDM operation.…”
Section: Introductionmentioning
confidence: 99%