2005 7th Electronic Packaging Technology Conference
DOI: 10.1109/eptc.2005.1614361
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Design and Development of Stacked Die Technology Solutions for Memory Packages

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Cited by 4 publications
(2 citation statements)
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“…With respect to die stacking (irrespective of conducting connections), we distinguish between arrangement (i.e. deciding on the functionality of each die level) [51,46,30] and the selection of specific die samples to be combined in the final SiP [28,81,89].…”
Section: Multiple Diesmentioning
confidence: 99%
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“…With respect to die stacking (irrespective of conducting connections), we distinguish between arrangement (i.e. deciding on the functionality of each die level) [51,46,30] and the selection of specific die samples to be combined in the final SiP [28,81,89].…”
Section: Multiple Diesmentioning
confidence: 99%
“…Proactive [180], [282] Multiple Dies Integration Wiring Mechanical [248], [118] Thermal/Chemical [118,21,19], [36] Stacking Arrangement [51,46,30] Selection [28,81,89]…”
Section: Single Diementioning
confidence: 99%