Design and Demonstration of Highly Miniaturized, Low Cost Panel Level Glass Package for MEMS Sensors

Buch, Chintan; Struk, Daniel; Wolter, Klaus‐Jürgen; Hesketh, Peter J.; Tummala, Rao; Shearer, Catherine; Haley, James; Findlay, Mel; Papageorge, Marc

doi:10.1109/ectc.2017.283

Cited by 5 publications

(1 citation statement)

References 39 publications

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“…Glass is a material of interest for packaging optical MEMS devices, such as micro-mirrors and image sensors. It offers a wide range of wavelength transparency, low production cost, high chemical stability and low electrical parasitics element [1]. At present, there are some waver-level glass bonding technologies, such as glass frit and anodic bonding [2].…”

Section: Introductionmentioning

confidence: 99%

Low-temperature Metal Bonding for Optical Device Packaging

Golim

Vuorinen

Tiwary

et al. 2021

2021 23rd European Microelectronics and Packaging Conference &Amp; Exhibition (EMPC)

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Low-temperature solid-liquid interdiffusion (SLID) bonding is an attractive alternative for the packaging of optical devices. It reduces global residual stress build up caused by differences in coefficient of thermal expansion (CTE) at elevated temperatures. This work applied the Cu-Sn-In-based SLID bonding method to bond silicon and optically transparent materials at 200 °C. Experimental results show a successful bonding with minor unavoidable misalignment from the CTE mismatch and major misalignment from the bonding alignment process. Microstructural analysis shows the intermetallic compound consists only of Cu6(Sn,In)5 on the bond that is thermally stable up to 600 °C.

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Section: Introductionmentioning

confidence: 99%