2018 IEEE 68th Electronic Components and Technology Conference (ECTC) 2018
DOI: 10.1109/ectc.2018.00066
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Design and Application of Innovative Multi-table and Bond Head Drive System on Thermal Compression Bonder with UPH Over 2000

Kohei Seyama
1
,
Shoji Wada
2
,
Yuji Eguchi
3
et al.
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Cited by 6 publications
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Development of Laser-Assisted Bonding with Compression (LABC) Process for 3D IC Integration

Choi
1
,
Eom
2
,
Moon
3
et al. 2019
2019 International 3D Systems Integration Conference (3DIC)
2
0
0
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Development of Laser-Assisted Bonding with Compression (LABC) Process for 3D IC Integration

Choi
1
,
Eom
2
,
Moon
3
et al. 2019
2019 International 3D Systems Integration Conference (3DIC)
2
0
0
0
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Enhanced Performance of Laser-Assisted Bonding with Compression (LABC) Compared with Thermal Compression Bonding (TCB) Technology

Choi
1
,
Eom
2
,
Moon
3
et al. 2019
2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
17
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Development of a Temporary Bonding Tape Having over 300 degC Thermal Resistance for Cu-Cu Direct Bonding

Daido
1
,
Watanabe
2
,
Takahashi
3
et al. 2021
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
11
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