2022
DOI: 10.1541/ieejjia.21004267
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Design a Continuous Switching Test Circuit for Power Devices to Evaluate Reliability

Abstract: This study presents a design method for the continuous switching test circuits of power devices. Depending on the relationship between the rated voltage of a DC voltage source and device under test (DUT), two types of test circuits are proposed. These test circuits comprise a cascaded buck-boost (or boost-buck) converter to achieve power regeneration. Based on analysis of the test circuits, a design method is proposed to ensure that any failure does not spread to the test circuit even when the DUT fails during… Show more

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Cited by 9 publications
(2 citation statements)
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“…To clarify the characteristic fluctuations due to temperature, measurements were conducted at ambient temperatures of 25 • C and 150 • C for the DUT. In this study, the "advanced high-temperature gate bias (HTGB) test" was conducted for the accelerated aging test, thereby enabling the accelerated aging of the gate oxide under the continuous switching condition of the DUT [37], [41], [42]. One of the features of the advanced HTGB test is that it enables accelerated aging under conditions similar to those in the actual use of power devices, compared to the conventional accelerated aging of gate oxide under static conditions.…”
Section: Figure 4 Principle Of Measurement By the Quasi-static Method...mentioning
confidence: 99%
“…To clarify the characteristic fluctuations due to temperature, measurements were conducted at ambient temperatures of 25 • C and 150 • C for the DUT. In this study, the "advanced high-temperature gate bias (HTGB) test" was conducted for the accelerated aging test, thereby enabling the accelerated aging of the gate oxide under the continuous switching condition of the DUT [37], [41], [42]. One of the features of the advanced HTGB test is that it enables accelerated aging under conditions similar to those in the actual use of power devices, compared to the conventional accelerated aging of gate oxide under static conditions.…”
Section: Figure 4 Principle Of Measurement By the Quasi-static Method...mentioning
confidence: 99%
“…Silicon carbide (SiC) power semiconductor devices exhibit excellent characteristics of low on-resistance and low failure risk in high junction-temperature environments when compared to Si power semiconductor devices [12]- [14]. SiC MOSFETs exhibit these advantages and are one of the leading candidates used in solid-state circuit breakers.…”
Section: Introductionmentioning
confidence: 99%