Deposition of hard wear-resistant coatings by reactive D.C. Plasmatron sputtering

Schiller, S.; Heisig, U.; Beister, G.; Steinfelder, K.; Strümpfel, J.; Korndörfer, Chr.; Sieber, William K.

doi:10.1016/0040-6090(84)90196-2

Cited by 52 publications

(14 citation statements)

References 29 publications

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“…It is clearly observed that the transmittance at 550 nm monotonically improved with the increase in the cathode current in the transition region, implying that the films were monotonically oxidized with increasing cathode current. The film which had the lowest resistivity of 4:4 Â 10 À4 cm was obtained at an optimum cathode current of 8 Fig. 6.…”

Section: Resultsmentioning

confidence: 99%

“…9) The difference between the cathode voltage of Zn and ZnO sputtering is sufficiently large (200-300 V), implying the large difference in the secondary electron emission coefficient which affects the plasma impedance. Moreover, the cathode voltage values do not show any duplication against the O 2 flow ratios, implying that the cathode voltage value could be useful for precise process stabilization 8) in the highly nonequilibrium transition region. In such a case the value of the cathode current is also useful during the sputtering process at a constant power mode.…”

Section: Introductionmentioning

confidence: 92%

“…7) For achieving a reproducible and stable deposition at a very high rate in the transition region, a reactive gas control method using a process parameter representative of the target surface should be highly suitable for controlling the deposition rate or the reactive gas flow precisely. 8) The several process parameters that continuously characterize the state of the process are known candidates such as cathode current, cathode voltage, reactive gas partial pressure, deposition rate, film properties, and the light emitted from the plasma. However, not all parameters are required for achieving fast control.…”

Section: Introductionmentioning

confidence: 99%

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Impedance Control of Reactive Sputtering Process in Mid-Frequency Mode with Dual Cathodes to Deposit Al-Doped ZnO Films

Kon

Song

Shigesato

et al. 2003

Jpn. J. Appl. Phys.

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Aluminum-doped zinc oxide (AZO) lms were deposited on glass substrates at 300 C by reactive mid-frequency (mf, 50 kHz) magnetron sputtering using dual magnetron cathodes with aluminum zinc alloy targets. In order to keep the very high deposition rate stable in the transition region of the reactive sputtering system, the reactive gas (O2) flow was controlled using the discharge impedance feedback system, where the discharge current value was used to control the O2 flow. The highest deposition rate for the transparent conductive AZO lms achieved by this dual magnetron sputtering (DMS) system was 242 nm/min, which was higher by one order of magnitude than that achieved by the conventional reactive sputtering system. The lowest resistivity of the AZO lm obtained by such a high deposition rate was 4:4 10 cm. The structure and electrical properties of the lms varied systematically by controlling the discharge current in the transition region using this system

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Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 92%

Section: Introductionmentioning

confidence: 99%

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Impedance Control of Reactive Sputtering Process in Mid-Frequency Mode with Dual Cathodes to Deposit Al-Doped ZnO Films

Kon

Song

Shigesato

et al. 2003

Jpn. J. Appl. Phys.

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“…The further reduction in deposition rate for CrN y coatings to 0.8 nm/s upon increasing p N 2 /p T to 0.69 is mainly based on poisoning effects, 37,38 as the coating is still singlephase cubic structured (see Fig. 2(b)).…”

Section: Methodsmentioning

confidence: 99%

Composition driven phase evolution and mechanical properties of Mo–Cr–N hard coatings

Klimashin

Riedl

Primetzhofer

et al. 2015

Journal of Applied Physics

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Although many research activities concentrate on transition metal nitrides, due to their excellent properties, only little is known about Mo–N based materials. We investigate in detail the influence of Cr on the structural evolution and mechanical properties of Mo–N coatings prepared at different nitrogen partial pressures. The chemical composition as well as the structural development of coatings prepared with N2-to-total pressure ratios (pN2/pT) of 0.32 and 0.44 can best be described by the quasi-binary Mo2N–CrN tie line. Mo2N and CrN are face centered cubic (fcc), only that for Mo2N half of the N-sublattice is vacant. Consequently, with increasing Cr content, also the N-sublattice becomes less vacant and the chemical composition of fcc single-phase ternaries can be described as Mo1−xCrxN0.5(1+x). These coatings exhibit an excellent agreement between experimentally and ab initio obtained lattice parameters of fcc Mo1−xCrxN0.5(1+x). When increasing the N2-to-total pressure ratio to pN2/pT = 0.69, the N-sublattice is already fully occupied for Cr-additions of x ≥ 0.4, as suggested by elastic recoil detection analysis and lattice parameter variations. The latter follows the ab initio obtained lattice parameters along the quasi-binary MoN–CrN tie line for x ≥ 0.5. The single-phase fcc coating with Cr/(Mo+Cr) of x ∼0.2, prepared with pN2/pT = 0.32, exhibits the highest hardness of ∼34 GPa among all coatings studied.

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“…[26,271. For a deposition which results in such films the concept 'partially reactive' is used sometimes [28]. Corresponding conditions are always linked with the metallic mode.…”

Section: Introductionmentioning

confidence: 99%

To the Kinetics of Nitrogen Incorporation during dc Magnetron Deposition

Sobe

1994

Contrib. Plasma Phys.

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Investigations of nitrogen incorporation during film deposition by dc magnetron sputtering with a CrSiAl target in Ar/N, mixtures have been carried out in the range of the metallic mode. The rate of the nitrogen consumption is proportional to the nitrogen partial pressure during deposition and to the amperage. The corresponding rate constant decreases with the argon pressure. Furthermore, the condensation rate of the target species decreases with the nitrogen partial pressure and is determined by the rate constant of the nitrogen consumption. The experimental results are explained by a 4-stepped reaction sequence of nitrogen incorporation consisting in ( I ) ionization, (2) ion bombardment of the target and formation of a coverage by plating, (3) removal of the coverage by the sputter process, (4) condensation on the substrate.

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Deposition of hard wear-resistant coatings by reactive D.C. Plasmatron sputtering

Cited by 52 publications

References 29 publications

Impedance Control of Reactive Sputtering Process in Mid-Frequency Mode with Dual Cathodes to Deposit Al-Doped ZnO Films

Impedance Control of Reactive Sputtering Process in Mid-Frequency Mode with Dual Cathodes to Deposit Al-Doped ZnO Films

Composition driven phase evolution and mechanical properties of Mo–Cr–N hard coatings

To the Kinetics of Nitrogen Incorporation during dc Magnetron Deposition

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