Dependence of the Generation Behavior of Charged Nanoparticles and Ag Film Growth on Sputtering Power during DC Magnetron Sputtering

Abstract

Effects of sputtering power on the deposition rate and microstructure, crystallinity, and electrical properties of Ag films during direct current (DC) magnetron sputtering are investigated. Thin films (~ 100 nm) are deposited at sputtering powers of 10, 20, 50, 100, 200 and 300 W and analyzed by field-emission scanning electron microscopy (FESEM), X-ray diffraction (XRD), transmission electron microscopy (TEM) and a four-point probe. The film deposited at a sputtering power of 10 W has the lowest growth rate, but the highest crystalline quality, with the lowest full width at half maximum (FWHM) and the lowest resistivity. The film deposited at a sputtering power of 200 W has the highest growth rate, and the second best crystalline quality in view of FWHM and resistivity. The film deposited at a sputtering power of 50 W has the moderate growth rate, and the worst crystalline quality in view of FWHM and resistivity. High-resolution TEM observations reveal that films deposited at sputtering powers of 10 and 200 W have far fewer defects, such as grain boundaries, dislocations and stacking faults than those deposited at a sputtering power of 50 W. Such deposition behavior could be explained by sputtering power, which affected the generation of the charged nanoparticles. And the high quality of films could be obtained at a high deposition rate, in which charge plays an important role. Graphic Abstract

Ultrafast nonlinear absorption properties of SnO2/Ag/SnO2 composite films based on Z-scan measurement

“…These two factors collectively contribute to the insignificant effect of changing the Ag sputtering power on the thickness of the composite films at lower powers. A similar conclusion was also reached in the study of Huang et al 37 and Jang et al 38 Figure 5 show the EDS spectra and mapping of the SAS composite films. The obtained results indicate the presence of Sn, O, and Ag elements in the composite films.…”

Bottom Deposition Enables Stable All‐Solid‐State Batteries with Ultrathin Lithium Metal Anode

“…[20] Conversely, XRD analysis results of AgCu reveal newly formed peaks at 38.5°and 44.8°which indicate (111) and (200) planes of Ag, suggesting successful introduction of Ag on the Cu foil (Figure 2a). [21] Subsequently, actual Li electrodeposition behavior was investigated using as-prepared cells, where respective metal foils (Cu and AgCu) were adopted as the working electrode. As expected, voltage profiles in Figure 2b regarding experimental electrodeposition tests yielded distinctive results.…”

“…[ 20 ] Conversely, XRD analysis results of AgCu reveal newly formed peaks at 38.5° and 44.8° which indicate (111) and (200) planes of Ag, suggesting successful introduction of Ag on the Cu foil ( Figure a). [ 21 ]…”