Dependence of process parameters on planarization isolation and etching of sloped vias in polyimides for GaAs ICs

Singh, Jitendra Kumar; Roybardhan, A.; Kothari, H. S.; Singh, Balbir; Khokle, W.S.

doi:10.1109/proc.1987.13810

Cited by 4 publications

(2 citation statements)

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“…Control of sidewall profile angle is possible by varying gas concentrations, plasma power, and ambient pressure [240][241][242][243]. High aspect ratios have been reported for patterning polyimides with an electron-cyclotron resonance source and O 2 plasma [244].…”

Section: Removal Strategiesmentioning

confidence: 99%

Review of polymer MEMS micromachining

Kim

Meng

2015

J. Micromech. Microeng.

127

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The development of polymer micromachining technologies that complement traditional silicon approaches has enabled the broadening of microelectromechanical systems (MEMS) applications. Polymeric materials feature a diverse set of properties not present in traditional microfabrication materials. The investigation and development of these materials have opened the door to alternative and potentially more cost effective manufacturing options to produce highly flexible structures and substrates with tailorable bulk and surface properties. As a broad review of the progress of polymers within MEMS, major and recent developments in polymer micromachining are presented here, including deposition, removal, and release techniques for three widely used MEMS polymer materials, namely SU-8, polyimide, and Parylene C. The application of these techniques to create devices having flexible substrates and novel polymer structural elements for biomedical MEMS (bioMEMS) is also reviewed.

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Section: Removal Strategiesmentioning

confidence: 99%

Review of polymer MEMS micromachining

Kim

Meng

2015

J. Micromech. Microeng.

127

View full text Add to dashboard Cite

show abstract

“…In addition to the conventional processes such as near micron lithography and lift off, ohmic and Schottky contacts etc most of the state-of-the-art unit processes such as air bridge technology, rapid thermal processing, polymide passivation, via hole technology and Boron isolation have been standardised at CEERI [82][83][84].…”

Section: Inp Based Receh·ermentioning

confidence: 99%