2008 34th European Conference on Optical Communication 2008
DOI: 10.1109/ecoc.2008.4729209
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Demonstration of first WDM CMOS photonics transceiver with monolithically integrated photo-detectors

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Cited by 17 publications
(9 citation statements)
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“…The first demonstration of commercial silicon photonic packaging was in 2008 with the start of ePIXpack; using glass blocks for support, a fiber array was manually aligned to grating couplers and glued in place with epoxy [247]. This approach has been used a number of times since, improving on the concept [248], [249]. Passive alignment was first demonstrated by Galan et al, who used v-grooves to align a fiber to an inverted taper.…”
Section: Pa C K a G I N G A N D C O U P L I N Gmentioning
confidence: 99%
“…The first demonstration of commercial silicon photonic packaging was in 2008 with the start of ePIXpack; using glass blocks for support, a fiber array was manually aligned to grating couplers and glued in place with epoxy [247]. This approach has been used a number of times since, improving on the concept [248], [249]. Passive alignment was first demonstrated by Galan et al, who used v-grooves to align a fiber to an inverted taper.…”
Section: Pa C K a G I N G A N D C O U P L I N Gmentioning
confidence: 99%
“…Approaches include bonding techniques [9] and alignment of individual or arrays of lasers to a silicon bench [10,11], and a number of WDM transceivers have been proposed or demonstrated based on these various approaches [11][12][13][14][15]. In addition, realization of silicon photonic external modulators allows a graceful upgrade path to higher data rates (≥10Gbps).…”
Section: Wdm-pon Systemmentioning
confidence: 99%
“…Furthermore, fast and sensitive photodetectors [3] , as well as fast amplitude modulators [4] have been monolithically integrated on SOI. Some work has even been carried out to monolithically integrate SOI PICs with CMOS electronics [5] and to realise monolithic light sources on SOI [6] . Increasing level of integration on SOI can offer many benefits, such as the reduction of the footprint and assembly costs, low-cost mass production on large wafers and the elimination of optical junctions that reflect and scatter light.…”
Section: Introductionmentioning
confidence: 99%