2013
DOI: 10.1016/j.tca.2012.10.029
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Degree of imidization for polyimide films investigated by evolved gas analysis-mass spectrometry

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Cited by 14 publications
(8 citation statements)
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“…PAA solutions were prepared by adding the equimolar amount of dianhydrides into the N , N ‐dimethylacetamide solution of diamines according to a procedure of previous report . PAAs consist of BPDA, ODA, and PDA for PAA‐1, BPDA, PMDA, BTDA, ODA, and PDA for PAA‐2, BPDA and PDA for PAA‐3, and BPDA, PMDA, BTDA, and PDA for PAA‐4.…”
Section: Methodsmentioning
confidence: 99%
See 1 more Smart Citation
“…PAA solutions were prepared by adding the equimolar amount of dianhydrides into the N , N ‐dimethylacetamide solution of diamines according to a procedure of previous report . PAAs consist of BPDA, ODA, and PDA for PAA‐1, BPDA, PMDA, BTDA, ODA, and PDA for PAA‐2, BPDA and PDA for PAA‐3, and BPDA, PMDA, BTDA, and PDA for PAA‐4.…”
Section: Methodsmentioning
confidence: 99%
“…Many articles have been reported for the thermal behavior of PI film, the surface modification of PI, the fabrication analysis, and the degree of imidization, respectively. In general, PIs provide wide variations in technical properties according to their chemical structures.…”
Section: The Chemical Structures In Figures Andmentioning
confidence: 99%
“…Then, it was heated by a vacuum oven (Reale, Dongguan, China) in stages to elevated temperatures to further remove solvent and convert the amic acid functional groups to imides with a cyclodehydration reaction, the detailed thermal imidization procedure is shown in Figure S1 (Supplementary Materials, Figure S1). The rising and cooling process has been optimized according to the previous study [14][15][16] to ensure the fully imidization of co-PAI. In the current work, to ensure the optical uniformity of a large diameter co-PAI membrane for optical use, spin coating and thermal imidization procedure will be repeated three times.…”
Section: Preparation Of Copolyamide-imide Membranementioning
confidence: 99%
“…The unique chemical structure endues excellent resistance to high temperature (long‐term 250–300°C, short‐term 400–500°C) as well as high strength and modulus of PI materials . At the same time, it possesses the characteristics of space material with low vacuum volatiles and low volatile agglomerates . Therefore, PI is considered to be one of the most promising engineering materials in the 21st century , thus possesses broad application prospects and great commercial value in the aerospace, microelectronics, precision machinery, medical equipment, and other high‐tech fields .…”
Section: Introductionmentioning
confidence: 99%