Degradation of moulding compounds during highly accelerated stress tests – A simple approach to study adhesion by performing button shear tests

Addressing Delamination for Fast Development of Reliable Packages

“…Experimental methods to low temperature have to be an also be used to look at the storage [4] or moisture on simulation can be generated. ulations to look at delamination ad conditions.…”

“…[4] In th moved against a button of the m versa -and the force-displace kaging Technology Conference Packages illustration of the development ment phase typically different of design and materials are At the end of this phase specific onstitute the basis for further dy been mentioned in the delamination with common onsuming procedure.…”

“…Fo the effect of the variation of adhesion un conditions finite element simulation has to b Application of Simulation FEM simulation plays a key role in es between the results of the button shear test of the package. Cohesive zone elements wer the button shear test, as described in [4]. O cohesive zone modelling is that no pre-crac the case with common fracture mecha Comparison of the simulations with results (Deformation Analysis by Correlation) me checking the simulation results.…”

Button shear testing for adhesion measurements of 2D materials

“…Here, we introduce button shear testing as a quantitative method for determining the shear strengths of 2D materials. Button shear testing is an established method for adhesion measurements in typical semiconductor technologies and materials 43 – 48 , which yields rapid and conclusive results based on vast existing knowledge. We demonstrate the feasibility of the method for different 2D materials and substrate combinations and its application in evaluating the effect of sample treatments on adhesion.…”

Effects of High-Temperature Storage on the Elasticity Modulus of an Epoxy Molding Compound

“…The visco-elastic mechanical properties of two commercial EMC materials has been measured as a function of aging time, and the effect of EMC curing during its lifetime on the package reliability is reported [10]. Many researchers have investigated the effects of high-temperature aging on the thermo-mechanical properties and microstructures of the molding compounds, and finite element models have been established to simulate aging effects on the stress and strain of the packaging [11,12,13,14]. Cui developed a new numerical method for simulating the thermal oxidation–diffusion of epoxy molding compounds, based upon the similarities between oxidative diffusion and heat transfer equations [15].…”