Addressing Delamination for Fast Development of Reliable Packages

Abstract

A AbstractDelamination remains a major problem of semiconductor components. It is typical temperature cycling tests, which are rathe The paper presents an approach to provide selection in the early development phase b measurements and simulation. The appro improved base for decision and allows to re times.

Package reliability and performance trends in an era of product integration

“…The power-law coefficient of n=2 in the ΔT relation used to compute the standards is sufficient to trend many temperature cycling failures however modifications have occurred to correct for creep or other phenomena [15]. Models that use metrics such as critical stress or fracture energy trend much differently than the original Coffin-Manson relationship [16,17]. Use of the proper physics of failure metric enables generational and geometric trending and issue mitigation which cannot occur when plotting the empirical metric of cycles to failure vs. form-factor data.…”