Deformation control of microbridges for flow sensors

Matsuura, T.; Taguchi, M.; Kawata, Kaoru; Tsutsumi, Kazuhiko

doi:10.1016/s0924-4247(97)01351-4

Cited by 12 publications

(9 citation statements)

References 7 publications

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“…The use of free-standing structures as 1 http:www.ikerlan.es. valves or valve components [4][5][6][7], liquid [8,9] and gas [10] flow sensing applications has been previously reported. The size of the structures, 600 µm to 1 mm, and their orientation, parallel to the substrate, make the device surface larger and the architecture more complicated, which has an impact on the final cost.…”

Section: Introductionmentioning

confidence: 99%

Fabrication of SU-8 free-standing structures embedded in microchannels for microfluidic control

Ezkerra¹,

Fernández²,

Mayora³

et al. 2007

J. Micromech. Microeng.

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The application of cantilevered structures as check valves or flow sensors can provide new possibilities towards the integration of accurate sample preparation systems within a lab-on-a-chip. The cantilevers presented in this paper act as flaps enclosed within a channel in a direction perpendicular to the flow. This orientation allows simpler designs and easier integration of the valve or flow sensor within the microfluidic network. The cantilevers have been embedded in a microfluidic channel by low temperature full wafer adhesive bonding. In this way, electrodes, microchannels, microchambers and cantilevers can be fabricated and sealed at the same time at a wafer level. To the author's knowledge, this is the first example of flap cantilevers embedded in a polymeric microfluidic channel. The mobility of the structure and the leakage are dependent on the size of the sealing gaps between the cantilever and the enclosing channel. In this paper, we present three different fabrication methods for a range of bottom sealing gaps from the micro to the nanometer size. The top sealing gap is determined by the adhesive bonding and is 11 µm wide. Furthermore, various geometrical features have been introduced in order to optimize a valve or flow sensor. The characterization of the structures comprises measurements of the sensitivity of each cantilever design by obtaining their relative spring constant, measurements of their elastic and plastic working regimes and Young's modulus of the SU-8.

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Section: Introductionmentioning

confidence: 99%

Fabrication of SU-8 free-standing structures embedded in microchannels for microfluidic control

Ezkerra¹,

Fernández²,

Mayora³

et al. 2007

J. Micromech. Microeng.

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“…The microbridge testing method will find broad applications in the mechanical characterization of thin films, which are of interest to the microelectronics and MEMS industries. In addition, a microbridge is a fundamental structure in MEMS, which may be applied in the microbridge-based sensors, such as the flow sensors, humidity sensors, and chemical gas sensors etc 30,31 .…”

Section: Introductionmentioning

confidence: 99%

Microbridge testing of plasma-enhanced chemical-vapor deposited silicon oxide films on silicon wafers

Cao

Zhang

2005

Journal of Applied Physics

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This is the Pre-Published Version 2 Plasma-enhanced chemical vapor deposited (PECVD) silane-based oxides (SiO x ) have been widely used in both microelectronics and MEMS (MicroElectroMechanical Systems) to form electrical and/or mechanical components. In this paper, a novel nanoindentation-based microbridge testing method is developed to measure both the residual stresses and Young's modulus of PECVD SiO x films on silicon wafers. Theoretically, we considered both the substrate deformation and residual stress in the thin film and derived a closed formula of deflection versus load. The formula fitted the experimental curves almost perfectly, from which the residual stresses and Young's modulus of the film were determined. Experimentally, freestanding microbridges made of PECVD SiO x films were fabricated using the silicon undercut bulk micromachining technique. Some microbridges were subjected to rapid thermal annealing (RTA) at temperatures of 400ºC, 600ºC or 800ºC to simulate the thermal process in the device fabrication. The results showed that the asdeposited PECVD SiO x films had a residual stress of -155±17 MPa and a Young's modulus of 74.8±3.3 GPa. After the RTA, the Young's modulus remained relatively unchanged at around 75 GPa, however significant residual stress hysteresis was found in all the films. A microstructurebased mechanism was then applied to explain the experimental results of the residual stress changes in the PECVD SiO x films after the thermal annealing.

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“…18,19 The transverse bending caused by the difference in stress in the films forming a multilayer structure can represent an issue for the performance of MEMS diaphragm and membranes. From Eq.…”

Section: Theorymentioning

confidence: 99%

Bimaterial electromechanical systems for a biomimetical acoustic sensor

Mastropaolo

Latif

Koickal

et al. 2012

Journal of Vacuum Science &Amp; Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phen

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Full-field optical measurement of curvatures in ultra-thin-film-substrate systems in the range of geometrically nonlinear deformations Bimaterial planarized micromechanical beams have been designed, simulated, and fabricated with lengths in the range 800-5800 lm and distance to substrate 0.8-4.0 lm. The beams are to be used as vertical-mode resonant gates on p-type field-effect transistors for implementing an adaptable MEMS acoustic sensor inspired by the human ear. A process for fabricating planar bilayer double-clamped beams made of silicon nitride (SiN) and aluminum (Al(1%Si)) has been developed. The planar design and bimaterial approach allow the fabrication of relatively straight beams with length up to 5800 lm with the possibility of controlling the degree of static deflection of the beams. The fabricated beams have shown a maximum deflection of $300 nm and a transverse concave shape with respect to the substrate due to the bilayer nature of the structure. From wafer curvature measurements, the stress in the SiN and Al(1%Si) is 200 and 280 MPa, respectively. Finite element simulations and analysis of the profile of the beams have demonstrated that the films' stress magnitude influences the longitudinal and transverse profile of the beams. The fabricated devices resonate mechanically in the range 15-160 kHz. Preliminary electrical characterization of the devices has shown drain currents in the lA range for gate voltages of À20 to À25 V and drain voltages of À5

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Deformation control of microbridges for flow sensors

Cited by 12 publications

References 7 publications

Fabrication of SU-8 free-standing structures embedded in microchannels for microfluidic control

Fabrication of SU-8 free-standing structures embedded in microchannels for microfluidic control

Microbridge testing of plasma-enhanced chemical-vapor deposited silicon oxide films on silicon wafers

Bimaterial electromechanical systems for a biomimetical acoustic sensor

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