Microbridge testing of plasma-enhanced chemical-vapor deposited silicon oxide films on silicon wafers

Cao, Zhiqiang; Zhang, Tong‐Yi; Zhang, Xin

doi:10.1063/1.1898449

Cited by 16 publications

(13 citation statements)

References 35 publications

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“…Previous study has suggested that the deformable boundary was an important factor that results in the difference. A complicated mechanism model to modify boundary conditions has been employed to circumvent this problem [33]. However, the mechanism model still required FEM to obtain required parameters to solve the deformable boundary condition.…”

Section: Effect Of M H and α On The Thermoelastic Responsementioning

confidence: 99%

The deformation of microcantilever-based infrared detectors during thermal cycling

Lin

Zhang

2008

J. Micromech. Microeng.

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Uncooled microcantilever-based infrared (IR) detectors have recently gained interest due to their low noise equivalent temperature difference (NETD), while concurrently maintaining low costs. These properties have made them available for a wider range of applications. However, the curvature induced by residual strain mismatch severely compromises the device's performance. Therefore, to meet performance and reliability requirements, it is important to fully understand the deformation of IR detectors. In this study, bimaterial (SiN x /Al) microcantilever-based IR detectors were fabricated using surface micromachining with polyimide as a sacrificial layer. Thermo-mechanical deformation mechanisms were studied through the use of thermal cycling. A temperature chamber with accurate temperature control and an interferometer microscope were adopted in this study for thermal cycling and full-field curvature measurements. It was found that thermal cycling reduced the residual strain mismatch within the bimaterial structure and thus flattened the microcantilever-based IR detectors. Specifically, thermal cycling with a maximum temperature of 295 • C resulted in a 97% decrease in curvature of the microcantilever-based IR detectors upon return to room temperature. The thermoelastic deformation of the IR detectors was modeled using both finite element method (FEM) and analytical methods. A modified analytical solution based on plate theory was established to describe the thermoelastic mechanical responses by using a correction factor derived from FEM. Although in the current study Al and SiN x were chosen for the application of microcantilever-based IR detectors, the general experimental protocol and modeling approach can be applied to describe thermoelastic mechanical responses of bimaterial devices with different materials. Toward the end of this paper, we studied the correction factors in the modified analytical solution while varying parameters such as Young's modulus ratio, thickness ratio and coefficient of thermal expansion (CTE) mismatch to investigate the influences of these parameters.

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Section: Effect Of M H and α On The Thermoelastic Responsementioning

confidence: 99%

The deformation of microcantilever-based infrared detectors during thermal cycling

Lin

Zhang

2008

J. Micromech. Microeng.

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“…To evaluate the mechanical performance of the transparency, we have characterized the transparency cantilever beams with different thickness using nanoindentation measurement. The test was conducted on a TriboIndenter TM nanoindentation system (Hysitron Inc.) equipped with a 20 µm width wedge tip [15]. The cantilever beams were carefully aligned to be perpendicular to either the x-or y-axis of the nanoindenter stage.…”

Section: Nanoindentation Proceduresmentioning

confidence: 99%

Implementation of microfluidic devices at a transparency

Li¹,

Schwarz²,

Sharon³

2006

J. Micromech. Microeng.

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We have developed a scanning laser manufacturing technique to produce microfluidic structures directly on photocopy transparency films. The reasons for the selection of transparency include (i) its insignificant water diffusion and vapor loss characteristics, (ii) its reduced viscoelastic behavior and (iii) its very low cost. The stiffness of the transparency membrane can be carefully tailored by adjusting laser ablation power. To show the feasibility of the approach, we have fabricated membrane valves on the transparency, and demonstrated a peristaltic micro-pumping system. Our investigation offers the potential for developing new types of very low-cost disposable devices including flexible microfluidic systems.

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“…In this section, we introduce a novel nanoindentation-based microbridge testing method, which has the advantage of being able to measure residual stress and Young's modulus of the thin film material simultaneously (Cao et al 2005). It is also easier to handle than uniaxile micro-tensile testing and avoids the problem of stress concentration of the bulge testing method (Cao et al 2005).…”

Section: Methodsmentioning

confidence: 99%

“…It is also easier to handle than uniaxile micro-tensile testing and avoids the problem of stress concentration of the bulge testing method (Cao et al 2005).…”

Section: Methodsmentioning

confidence: 99%

“…In the experimental setup, a nanoindenter applies the loads at the center of the microbridges, and obtains a high-resolution experimental loaddisplacement relationship. To analyze the data, we apply a theoretical model that uses a closed formula of deflection vs load, considering both substrate deformation and residual stress in the film (Cao et al 2005). Both residual stress and Young's modulus can be simultaneously evaluated.…”

Section: (B)mentioning

confidence: 99%

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Residual Stress and Fracture of PECVD Thick Oxide Films for Power MEMS Structures and Devices

Zhang¹

2007

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Public reporting burden for this collection of information is estimated to average 1 hour per response, including the time for reviewing instructions, seerching data sources, gathering and maintaining the data needed, and completing and reviewing the collection of information. Send comments regarding this burden estimate or any other aspect of this collection of information, including suggestions for reducing this burden to Washington Headquarters Service, Directorate for Information Operations and Reports, 1215 Jefferson Davis Highway, Suite 1204, Arlington, VA 22202-4302, and SUPPLEMENTARY NOTES14. ABSTRACT Plasma enhanced chemical vapor deposited (PECVD) silicon oxide (SiOx) is the most commonly used interlayer dielectric (ILD) in MEMS devices and structures. In this project, PECVD SiOx is chosen as an example for the systematic study of mechanical behavior and underlying casual mechanisms of amorphous thin films for MEMS applications, which are generally less well understood because of the complex interplay among the deformation mechanisms. In this project, PECVD SiO, is chosen as an example for the systematic study of mechanical behavior and underlying causal mechanisms of amorphous thin films for MEMS applications, which are generally less well understood because of the complex interplay among the deformation mechanisms. SUBJECT TERMSMechanical behaviors of the PECVD SiOx thin films are probed at 1) different size scales (from wafer level down to micro/nano-scale, and different lengthscale within each realm); 2) different temperatures (from room temperature up to 1100 0C); and 3) with a combination of different experimental techniques (such as substrate curvature measurements, nanoindentation tests, and a novel "microbridge testing" technique, etc.). A broad range of mechanical analysis is covered, including film stress and related material properties changes, elastic properties, plastic properties (both time-independent and time-dependent), deformation mechanisms (both at room temperature and elevated temperatures).Wherever applicable, materials analysis techniques such as SEM, AFM, FTIR, XRD, and SIMS were employed to strengthen the discussions on the structureproperties relationship and the causal mechanisms of the mechanical responses of the PECVD SiOx. These experiments reveal various interesting arid disiirictive characteristics of the mechanical responses of the PECVD SiOx thin films, and the microstructural causal mechanisms for each of them are analyzed in depth.The outcome of this work will provide a comprehensive characterization of the mechanical responses of the PECVD SiOx thin films under different thermal conditions, stress levels, size scales, and in both elastic and plastic regions. In addition, both new experimental methodologies and theoretical models for data 3 analysis are resulted, which can be readily applied to a wide variety of thin film materials for various different applications. Last but not least, the physical causal mechanisms for the experimental results are elucidated, ...

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Microbridge testing of plasma-enhanced chemical-vapor deposited silicon oxide films on silicon wafers

Cited by 16 publications

References 35 publications

The deformation of microcantilever-based infrared detectors during thermal cycling

The deformation of microcantilever-based infrared detectors during thermal cycling

Implementation of microfluidic devices at a transparency

Residual Stress and Fracture of PECVD Thick Oxide Films for Power MEMS Structures and Devices

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