Abstract:Defect formation and doping limits in semiconductors are discussed in terms of the amphoteric defect model (ADM). It is shown that the nature of defects, acceptor-like or donor-like, depends on the location of the Fermi energy relative to a common energy reference, the Fermi level-stabilization energy. The maximum free electron or hole concentration that can be achieved by doping is an intrinsic property of a given semiconductor and is fully determined by the location of the semiconductor band edges with respe… Show more
“…The amphoteric native defect model proposed by Walukiewicz [87][88][89] and experimental DFT calculations suggest that with heavy n-type doping the Fermi level shifts toward the conduction band and there is a resultant decrease in the enthalpy of formation for negatively charged V III . 75,90,91 The formation energy of these defects is dependent on the background electrical characteristics such that any dopant species which can cause the requisite Fermi level shift would result in lowering of the formation energy of vacancies.…”
Section: Ecs Journal Of Solid State Science and Technology 5 (5) Q12mentioning
confidence: 99%
“…111 Dopant-defect complexing seems to provide the best explanation of the observed equilibrium electrical activation limits 89,[112][113][114][115] and diffusion phenomenon in n-InGaAs substrates and there is a large body of experimental evidence suggesting that high vacancy concentrations exist in heavily n-type GaAs substrates.…”
Section: Concentration Dependent Si Diffusion In Ingaas Andmentioning
An overview of various processing and dopant considerations for the creation of heavily-doped n-InGaAs is presented. A large body of experimental evidence and theoretical prediction point to dopant vacancy-complexing as the limiting mechanism for electrical activation in heavily Si doped InGaAs and GaAs. Dopant incorporation techniques which require thermal treatment steps to move dopants onto lattice sites like ion implantation and monolayer doping exhibit stable activation up to a limit of ≈1.5 × 1019 cm−3. Growth-based dopant incorporation methods have shown much higher (5 × 1019 cm−3) active concentrations but these activate concentrations are shown in multiple studies to be metastable. Other device specific process-flow constraints with respect to modern CMOS devices which may make some means of dopant incorporation method, or species selection more appropriate for a given application are also discussed.
“…The amphoteric native defect model proposed by Walukiewicz [87][88][89] and experimental DFT calculations suggest that with heavy n-type doping the Fermi level shifts toward the conduction band and there is a resultant decrease in the enthalpy of formation for negatively charged V III . 75,90,91 The formation energy of these defects is dependent on the background electrical characteristics such that any dopant species which can cause the requisite Fermi level shift would result in lowering of the formation energy of vacancies.…”
Section: Ecs Journal Of Solid State Science and Technology 5 (5) Q12mentioning
confidence: 99%
“…111 Dopant-defect complexing seems to provide the best explanation of the observed equilibrium electrical activation limits 89,[112][113][114][115] and diffusion phenomenon in n-InGaAs substrates and there is a large body of experimental evidence suggesting that high vacancy concentrations exist in heavily n-type GaAs substrates.…”
Section: Concentration Dependent Si Diffusion In Ingaas Andmentioning
An overview of various processing and dopant considerations for the creation of heavily-doped n-InGaAs is presented. A large body of experimental evidence and theoretical prediction point to dopant vacancy-complexing as the limiting mechanism for electrical activation in heavily Si doped InGaAs and GaAs. Dopant incorporation techniques which require thermal treatment steps to move dopants onto lattice sites like ion implantation and monolayer doping exhibit stable activation up to a limit of ≈1.5 × 1019 cm−3. Growth-based dopant incorporation methods have shown much higher (5 × 1019 cm−3) active concentrations but these activate concentrations are shown in multiple studies to be metastable. Other device specific process-flow constraints with respect to modern CMOS devices which may make some means of dopant incorporation method, or species selection more appropriate for a given application are also discussed.
“…Thus, more donors will form increasing the degree of compensation. Such a behavior can be described by the Fermi-level stabilization model [127][128][129] and is usually observed as an off-leveling of charge carrier concentration with increasing dopant concentration or by the fact that semiconductors can be doped only p-type or n-type [130,131]. The effect has been observed till now as the self-compensation of extrinsic dopants by native defects.…”
“…Possibly present trap states in the bandgap would also simply be filled or emptied upon doping. However, it is well known that charging of semiconductors can result in the formation of charge-compensating defects . For semiconductor nanocrystals such defects most likely appear on the surface in the form of local reduction/oxidation of surface atoms or the formation of dimers .…”
Section: Introductionmentioning
confidence: 99%
“…However, it is well known that charging of semiconductors can result in the formation of charge-compensating defects. 28 For semiconductor nanocrystals such defects most likely appear on the surface in the form of local reduction/oxidation of surface atoms or the formation of dimers. 29 For example, Du Fosséet al showed in a computational study that Cd-based QDs without dangling bonds are stable up to a charge of one electron but form trap states after injection of more electrons.…”
Quantum dots (QDs) are known for their size-dependent optical properties, narrow emission bands, and high photoluminescence quantum yield (PLQY), which make them interesting candidates for optoelectronic applications. In particular, InP QDs are receiving a lot of attention since they are less toxic than other QD materials and are hence suitable for consumer applications. Most of these applications, such as LEDs, photovoltaics, and lasing, involve charging QDs with electrons and/or holes. However, charging of QDs is not easy nor innocent, and the effect of charging on the composition and properties of InP QDs is not yet well understood. This work provides theoretical insight into electron charging of the InP core and InP/ZnSe QDs. Density functional theory calculations are used to show that charging of InP-based QDs with electrons leads to the formation of trap states if the QD contains In atoms that are undercoordinated and thus have less than four bonds to neighboring atoms. InP coreonly QDs have such atoms at the surface, which are responsible for the formation of trap states upon charging with electrons. We show that InP/ZnSe core−shell models with all In atoms fully coordinated can be charged with electrons without the formation of trap states. These results show that undercoordinated In atoms should be avoided at all times for QDs to be stably charged with electrons.
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