2015
DOI: 10.1039/c4nr07585d
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Defect/oxygen assisted direct write technique for nanopatterning graphene

Abstract: High resolution nanopatterning of graphene enables manipulation of electronic, optical and sensing properties of graphene. In this work we present a straightforward technique that does not require any lithographic mask to etch nanopatterns into graphene. The technique relies on the damaged graphene to be etched selectively in an oxygen rich environment with respect to non-damaged graphene. Sub-40 nm features were etched into graphene by selectively exposing it to a 100 keV electron beam and then etching the da… Show more

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Cited by 11 publications
(9 citation statements)
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“…In order to make the hybrid conductor of Ag NW-GP with high optical and electrical properties, there has been big progress in GP mesh engineering by tailoring its pattern into predefined shapes, position, and sizes at atomic scale mainly through (i) vacuum processes of He-ion/electron beam lithography, O 2 plasma etching, nanoimprint lithography, catalytic passivation, catalytic etching and hot embossing imprinting [13][14][15][16][17][18][19][20], and (ii) non-vacuum approaches of laser-assisted transfer printing, laser ablation, micro-molding, and masking layer based mesh-patterning [21][22][23][24][25][26][27].…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…In order to make the hybrid conductor of Ag NW-GP with high optical and electrical properties, there has been big progress in GP mesh engineering by tailoring its pattern into predefined shapes, position, and sizes at atomic scale mainly through (i) vacuum processes of He-ion/electron beam lithography, O 2 plasma etching, nanoimprint lithography, catalytic passivation, catalytic etching and hot embossing imprinting [13][14][15][16][17][18][19][20], and (ii) non-vacuum approaches of laser-assisted transfer printing, laser ablation, micro-molding, and masking layer based mesh-patterning [21][22][23][24][25][26][27].…”
Section: Introductionmentioning
confidence: 99%
“…First, most GP patterning approaches require complicated, low durability and expensive lithographic steps, instruments, and materials, leading to lacked scalability and low production speed of GP meshes [13][14][15][16][17][18][19][20][21][22][23][24][25][26][27][28][29]. Specifically, the as-mentioned patterning process for GP involves multiple steps of complicated template/mask preparation (mask lithography), lifting/stamping of patterned GP onto a substrate, photoresist (PR) developing, etching, PR/mask removal, and laser ablation [13][14][15][16][17][18][19][20][21][22][23][24][25][26][27]. Second, the optical interference effect (i.e., Moire phenomenon) can be observed in the display image because of a constructive and destructive interferences by regularly arrayed voids in GP mesh [34,35].…”
Section: Introductionmentioning
confidence: 99%
“…33 It implies that the structural disorder was induced by not only the thermal induced defects but also by bonded oxygen, because oxygen can bond to SLG defects and would be much easier via heating treatment. 34,35 Moreover, the doping level could be monitored by considering the inverse relation of I(2D)/I(G). 28 Consequently, according to the reduced I(2D)/I(G) in pace with the increasing I(D)/I(G) in Fig.…”
Section: Defect On Slg Basal During Laser Heatingmentioning
confidence: 99%
“…These stray electrons can not only cause unwanted proximity effects and pattern distortion but also cause direct damage to the graphene at electron energies well below the 85 keV threshold for knock-on damage. 21,22 The most frequently used and studied positive electron beam resist in graphene research, PMMA, is not only chain-scissioned but also cross-linked under electron beam irradiation, which would make residues less soluble and ultimately increase doping levels compared to NIL. Moreover, the carrier mobility can also be reduced in patterned areas, 23 and since the patterns in samples such as ours are fairly dense, we attribute the low level of doping and defect generation to the avoidance of electron beam irradiation.…”
mentioning
confidence: 99%