Defect detection in patterned wafers using multichannel Scanning Electron Microscope

Zontak, Maria; Cohen, Israel

doi:10.1016/j.sigpro.2009.02.010

Cited by 16 publications

(4 citation statements)

References 21 publications

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“…the ones in sections 3.1-3.5) highly rely on innovations in optical microscopy techniques. Optical imaging-based defect inspection technology acquires position-registered images of a wafer specimen [161,165], while the specimen base plate is scanning over a region of interest. Defect signals are detected by a fast image-comparison algorithm that processes acquired images with reference defect-free images [165].…”

Section: Defect Inspection Using Hyperbolic Bloch Modesmentioning

confidence: 99%

“…Optical imaging-based defect inspection technology acquires position-registered images of a wafer specimen [161,165], while the specimen base plate is scanning over a region of interest. Defect signals are detected by a fast image-comparison algorithm that processes acquired images with reference defect-free images [165]. Generally speaking, conventional defect inspection systems (especially the ones used in the fab) are able to inspect all types of defects.…”

Section: Defect Inspection Using Hyperbolic Bloch Modesmentioning

confidence: 99%

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Optical wafer defect inspection at the 10 nm technology node and beyond

Zhu¹,

Liu²,

Xu³

et al. 2022

Int. J. Extrem. Manuf.

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The growing demand for electronic devices, smart devices, and the Internet of Things constitutes the primary driving force for marching down the path of decreased critical dimension and increased circuit intricacy of integrated circuits. However, as sub-10 nm high-volume manufacturing is becoming the mainstream, there is greater awareness that defects introduced by original equipment manufacturer components impact yield and manufacturing costs. The identification, positioning, and classification of these defects, including random particles and systematic defects, are becoming more and more challenging at the 10 nm node and beyond. Very recently, the combination of conventional optical defect inspection with emerging techniques such as nanophotonics, optical vortices, computational imaging, quantitative phase imaging, and deep learning is giving the field a new possibility. Hence, it is extremely necessary to make a thorough review for disclosing new perspectives and exciting trends, on the foundation of former great reviews in the field of defect inspection methods. In this article, we give a comprehensive review of the emerging topics in the past decade with a focus on three specific areas: (1) the defect detectability evaluation, (2) the diverse optical inspection systems, and (3) the post-processing algorithms. We hope, this work can be of importance to both new entrants in the field and people who are seeking to use it in interdisciplinary work.

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Section: Defect Inspection Using Hyperbolic Bloch Modesmentioning

confidence: 99%

Section: Defect Inspection Using Hyperbolic Bloch Modesmentioning

confidence: 99%

Optical wafer defect inspection at the 10 nm technology node and beyond

Zhu¹,

Liu²,

Xu³

et al. 2022

Int. J. Extrem. Manuf.

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“…At higher resolutions, scanning electron microscopy (SEM) is used (see e.g. Zontak and Cohen 2009) or SPMs, and their limitations were discussed in section 1. Ultra-violet microscopes have also been developed, mainly for critical dimension measurement, but also suffer from slow speeds and relatively small fields of view (Bodermann et al 2012).…”

Section: Microelectronics Manufacturementioning

confidence: 99%

Applications of super-resolution imaging in the field of surface topography measurement

Leach¹,

Sherlock²

2013

Surf. Topogr.: Metrol. Prop.

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A large range of high-value manufactured parts require structures to be produced over large areas (metres squared) at high-resolution (micrometres and smaller). Such manufacturing puts demands on the metrology that is required to assure product quality. High-speed, in-line metrology solutions are required to operate over large ranges with high-resolution. In this review, the use of optical super-resolution techniques to enhance the dynamic range of surface topography measuring instruments to allow them to be used in high dynamic range manufacturing scenarios will be highlighted. A brief discussion of optical super-resolution will be given, followed by a presentation of applications that may be able to benefit from optical super-resolution techniques, from the fields of microelectronics, structured surfaces and roll-to-roll manufacturing.

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“…More recently, Fu et al [10] proposed a new method of integrating robot arms and a confocal microscope to measure the surface roughness of objects. For high-precision applications, scanning electron microscopy can detect nanoscale defects [11]. Zhu et al [12] used a circle-structure light to measure and inspect inner surface.…”

Section: Introductionmentioning

confidence: 99%

Efficient Shape Estimation of Transparent Microdefects with Manifold Learning and Regression on a Set of Saturated Images

Deng¹,

Pan²,

Zhong³

2020

Applied Sciences

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Featured Application: The paper provides a convenient method to determine if a suspected microdefect of polarizer film is real. This is useful for manufacturing of diverse flexible/ transparent thin-film. Abstract:In the industry of polymer film products such as polarizers, measuring the three-dimensional (3D) contour of the transparent microdefects, the most common defects, can crucially affect what further treatment should be taken. In this paper, we propose an efficient method for estimating the 3D shape of defects based on regression by converting the problem of direct measurement into an estimation problem using two-dimensional imaging. The basic idea involves acquiring structured-light saturated imaging data on transparent microdefects; integrating confocal microscopy measurement data to create a labeled data set, on which dimensionality reduction is performed; using support vector regression on a low-dimensional small-set space to establish the relationship between the saturated image and defects' 3D attributes; and predicting the shape of new defect samples by applying the learned relationship to their saturated images. In the discriminant subspace, the manifold of saturated images can clearly show the changing attributes of defects' 3D shape, such as depth and width. The experimental results show that the mean relative error (MRE) of the defect depth is 3.64% and the MRE of the defect width is 1.96%. The estimation time consumed in the Matlab platform is less than 0.01 s. Compared with precision measuring instruments such as confocal microscopes, our estimation method greatly improves the efficiency of quality control and meets the accuracy requirement of automated defect identification. It is therefore suitable for complete inspection of products.

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Defect detection in patterned wafers using multichannel Scanning Electron Microscope

Cited by 16 publications

References 21 publications

Optical wafer defect inspection at the 10 nm technology node and beyond

Optical wafer defect inspection at the 10 nm technology node and beyond

Applications of super-resolution imaging in the field of surface topography measurement

Efficient Shape Estimation of Transparent Microdefects with Manifold Learning and Regression on a Set of Saturated Images

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