2020
DOI: 10.1109/jqe.2020.2988263
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Defect Assisted Carrier Multiplication in Amorphous Silicon

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Cited by 5 publications
(5 citation statements)
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“…Defect engineering has been one of the key strategies of material design and defect‐assisted CM had been previously reported in amorphous silicon. [ 33 ] Various defects and impurities are unavoidable during the growth processes of TMDCs. Among different defects, chalcogen vacancies are known to create sub‐gap states in TMDCs, [ 34 ] which provide possibilities to manipulate the threshold energy of CM.…”
Section: Resultsmentioning
confidence: 99%
“…Defect engineering has been one of the key strategies of material design and defect‐assisted CM had been previously reported in amorphous silicon. [ 33 ] Various defects and impurities are unavoidable during the growth processes of TMDCs. Among different defects, chalcogen vacancies are known to create sub‐gap states in TMDCs, [ 34 ] which provide possibilities to manipulate the threshold energy of CM.…”
Section: Resultsmentioning
confidence: 99%
“…In addition, the specific defects in AlN formed during the ALD deposition 38 , 44 , were believed to be responsible for the multiplication of the transported carriers due to the significantly increased tunneling current via the mechanism of trap-assisted tunneling 33 , 45 . Generally, the substitutional oxygen for nitrogen (O N ) and aluminum vacancy (V Al ) are the dominated defects in the ALD prepared AlN films 38 , and would form the shallow level defects with the corresponding energy level about 0.8 and 1.0 eV, respectively.…”
Section: Resultsmentioning
confidence: 99%
“…The current of a photodetector is composed of particle current and displacement current. Particle current is due to the flow of electrons and holes generated by photon absorption, dark current, and carrier multiplication such as impact ionization or CEP effect [1], [21]. Displacement current is due to charging/discharging of the device capacitance (Cj).…”
Section: Model Derivation and Pspice Implementationmentioning
confidence: 99%
“…For conventional SPADs, the carrier multiplication layer has a p-n or p-i-n structure, and for CEP detectors, the gain medium is a thin disordered medium such as undoped amorphous-silicon (a-Si). During operation, a voltage is applied to reverse bias the p/n junction or the disordered layer, allowing photo generated electrons (holes) to gain sufficient energy from the applied bias, and subsequently generate secondary electron-hole pairs via the effect of impact ionization or cycling excitation process (CEP), the latter of which also involves localized states and phonons [4], [21], [22]. The device dynamics such as gain build-up time and device response time depends on the multiplication process.…”
Section: Introductionmentioning
confidence: 99%