Decoupling Seebeck coefficient and resistivity, and simultaneously optimizing thermoelectric and mechanical performances for n-type BiTeSe alloy by multi-pass equal channel angular extrusion

Hu, Xiaoming; Fan, Xiaoliang; Feng, Bo; Kong, Dong; Liu, Peihai; Xu, Chenhui; Kuang, Zhixiang; Li, Guangqiang; Li, Yawei

doi:10.1016/j.mseb.2020.114846

Cited by 3 publications

(2 citation statements)

References 52 publications

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“…The heat conductivity

consists of two components: electron part

and lattice part

. There are two widely used mechanisms of

factor optimization: (1) doping the material to improve the Seebeck coefficient and electrical conductivity [ 10 ], and (2) material structurization, which has the highest impact on lattice thermal

conductivity [ 11 ]. The reduction in heat conductivity can also occur if the dopant atoms significantly differ from the main semiconductor structure (e.g., there is a significant difference in atomic mass).…”

Section: Introductionmentioning

confidence: 99%

Using the Spark Plasma Sintering System for Fabrication of Advanced Semiconductor Materials

Kaszyca,

Chmielewski,

Bucholc

et al. 2024

Materials

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The interest in the Spark Plasma Sintering (SPS) technique has continuously increased over the last few years. This article shows the possibility of the development of an SPS device used for material processing and synthesis in both scientific and industrial applications and aims to present manufacturing methods and the versatility of an SPS device, presenting examples of processing Arc-Melted- (half-Heusler, cobalt triantimonide) and Self-propagating High-temperature Synthesis (SHS)-synthesized semiconductor (bismuth telluride) materials. The SPS system functionality development is presented, the purpose of which was to broaden the knowledge of the nature of SPS processes. This approach enabled the precise design of material sintering processes and also contributed to increasing the repeatability and accuracy of sintering conditions.

show abstract

“…The heat conductivity

consists of two components: electron part

and lattice part

. There are two widely used mechanisms of

factor optimization: (1) doping the material to improve the Seebeck coefficient and electrical conductivity [ 10 ], and (2) material structurization, which has the highest impact on lattice thermal

Section: Introductionmentioning

confidence: 99%

Using the Spark Plasma Sintering System for Fabrication of Advanced Semiconductor Materials

Kaszyca,

Chmielewski,

Bucholc

et al. 2024

Materials

View full text Add to dashboard Cite

show abstract

“…The heat conductivity κ consists of two components: electron part κ e and lattice part κ l . There are two widely used mechanisms of ZT factor optimization: (1) doping the material to improve the Seebeck coefficient and electrical conductivity [10], and (2) material structurization, which has the highest impact on lattice thermal κ l conductivity [11]. The reduction in heat conductivity can also occur if the dopant atoms significantly differ from the main semiconductor structure (e.g., there is a significant difference in atomic mass).…”

mentioning

confidence: 99%

Using SPS Sintering System in Fabrication of Advanced Semiconductor Materials

Kaszyca,

Chmielewski,

Bucholc

et al. 2024

Preprint

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The interest in the Spark Plasma Sintering (SPS) technique has continuously increased over the last few years. This article shows the possibility of the development of a SPS device used for material processing and synthesis both in both scientific and industrial applications. This work presents an example of processing Arc-Meleted (half-Heusler, cobalt triantimonide) and SHS-synthesized semiconductors (bismuth telluride) materials with SPS device. The system functionalities expansion is presented, showing the possible way of increasing the information amount obtained about SPS processes and using the SPS apparatus for conducting synthesis of materials and increasing reproducibility and accuracy of process parameters control.

show abstract

Promising transparent and flexible thermoelectric modules based on p-type CuI thin films—A review

et al. 2022

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Decoupling Seebeck coefficient and resistivity, and simultaneously optimizing thermoelectric and mechanical performances for n-type BiTeSe alloy by multi-pass equal channel angular extrusion

Cited by 3 publications

References 52 publications

Using the Spark Plasma Sintering System for Fabrication of Advanced Semiconductor Materials

Using the Spark Plasma Sintering System for Fabrication of Advanced Semiconductor Materials

Using SPS Sintering System in Fabrication of Advanced Semiconductor Materials

Promising transparent and flexible thermoelectric modules based on p-type CuI thin films—A review

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