1998 Fourth International High Temperature Electronics Conference. HITEC (Cat. No.98EX145)
DOI: 10.1109/hitec.1998.676784
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Decision support system for high temperature electronics

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“…The major elements limiting the use of standard commercial technology for high-temperature, high-power electronics are silicon devices, capacitors, solders, plastic encapsulants, printed wiring boards, and wire bond(McCluskey et al 1998a). For temperatures up to 135°C (275°F), standard commercial devices and packaging technologies can be used.…”
mentioning
confidence: 99%
“…The major elements limiting the use of standard commercial technology for high-temperature, high-power electronics are silicon devices, capacitors, solders, plastic encapsulants, printed wiring boards, and wire bond(McCluskey et al 1998a). For temperatures up to 135°C (275°F), standard commercial devices and packaging technologies can be used.…”
mentioning
confidence: 99%