DC–DC Converter Technologies for On-Chip Distributed Power Supply Systems – 3D Stacking and Hybrid Operation

Takamiya, Makoto; Onizuka, Kohei; Ishida, Koichi; Sakurai, Takayasu

doi:10.1007/978-90-481-9379-0_16

Cited by 1 publication

(3 citation statements)

References 11 publications

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“…Inductors are an integral part of power electronic circuits. Nowadays, there is a great effort underway to miniaturize inductors to enable fully integrated singlechip electrical power converters [1][2][3][4][5][6]. This motivates the need for high-inductance-density and high-Q (efficient) microfabricated inductors with form factors that are amenable for integration or co-packaging with silicon integrated circuits (low profile and small areal footprint).…”

Section: Introductionmentioning

confidence: 99%

“…Currently, there is a great effort underway to miniaturize power inductors to enable fully integrated power converters of chip scale form factors [1][2][3][4][5][6]. A general trend in research and industry is to push the circuits to higher and higher switching frequencies (megahertz and beyond) to enable the use of smaller value, and hence smaller sized, inductors.…”

Section: Introductionmentioning

confidence: 99%

“…A general trend in research and industry is to push the circuits to higher and higher switching frequencies (megahertz and beyond) to enable the use of smaller value, and hence smaller sized, inductors. These trends have fueled the need for small-valued (nH to 1 Author to whom any correspondence should be addressed. μH) microfabricated power inductors suitable for monolithic integration or co-packaging with silicon integrated circuits.…”

Section: Introductionmentioning

confidence: 99%

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Microelectromechanical inductors with high inductance density via mechanical energy storage

Divakar

Zhang²,

Zito³

et al. 2012

J. Micromech. Microeng.

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This paper reports the design, fabrication and testing of microelectromechanical inductors (MEMIs) that show high electrical inductance by storing energy via a mechanically compliant flexure. The microfabricated MEMI structures comprise a simple electroplated Cu beam that is placed in a static magnetic field. Upon application of ac current, the conductor vibrates via electrodynamic interactions with the magnetic field. This electromechanical behavior manifests as a highly reactive (inductive) one-port electrical impedance. In this work, we explain the microfabrication processes and the subsequent characterization of a variety of test structures, which exhibit a peak quality factor up to 5.6 with net areal inductance densities of up to 3.5 µH/mm 2. These devices are envisioned as a passive energy storage component for exploring high-power-density electrical power converters.

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