Damage mechanics of microelectronics solder joints under high current densities

Ye, Hua; Basaran, Cemal; Hopkins, Douglas C.

doi:10.1016/s0020-7683(03)00175-6

Cited by 55 publications

(41 citation statements)

References 8 publications

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“…[4][5][6][7][8][9][10][11], it can be seen that the growth rate of both Ag in Sn and Cu in Sn is bigger than other phases. That is why the phases Cu 6 Sn 5 and Ag 3 Sn are bigger than other phases.…”

Section: Evolvement Of Microstructure Of Solder Jointsmentioning

confidence: 97%

“…The reliability of SMT solder joints is now more important than before Supported by Astronautic Technology Innovation Fund because only one solder joint's failure may cause a catastrophic result and give a serious worldwide influence. However, there has been little study on the solder joints' reliability in this serious condition although a lot of papers have been done in some kinds of thermal cycle load or in some kind of vibration/shock condition or in thermal-mechanical load [1][2][3][4][5][6][7][8][9][10]. These studies, although, may give some guidance to astronautic solder joints' reliability, they are not adapted to evaluate astronautic solder joints' reliability accurately.…”

Section: Introductionmentioning

confidence: 99%

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Astronautic PBGA (plastic ball grid array) solder joints’ reliability: under successive-high acceleration shock condition

Guo

Zhao

Zhu

et al. 2005

Int J Adv Manuf Technol

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Along with the development of the astronautic industry, more and more SMT solder joints have been used in missile, rocket and other important equipments where the environment of astronautic equipments is more serious and complex than that in normal conditions. In this present paper, reliability of a kind of astronautic PBGA256 assembly sample is considered under the successive-high acceleration shock condition. During the test, the thickness of InterMetal Compounds (IMCs) is considered and calculated by an equation to compare with each other. It is found that the growth rate of the phase of Cu 6 Sn 5 /Cu 3 Sn and Ag 3 Sn is larger that other phases. So in the finial micrographs the phase of Cu 6 Sn 5 /Cu 3 Sn and Ag 3 Sn is easy to observed. After 3 hours' successive-high acceleration (7g) shock, although the sample PBGA solder joints are still in good condition and have no obvious crack by SEM, in the micrograph of the solder joint there are some special phenomena that is not the same as that in normal condition or thermal fatigue load.

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Section: Evolvement Of Microstructure Of Solder Jointsmentioning

confidence: 97%

Section: Introductionmentioning

confidence: 99%

Astronautic PBGA (plastic ball grid array) solder joints’ reliability: under successive-high acceleration shock condition

Guo

Zhao

Zhu

et al. 2005

Int J Adv Manuf Technol

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show abstract

“…However, this is not true for solder alloys because of their very low melting temperature (around 200°C). This effect must be taken into consideration when investigating the reliability of solder joint as is shown by Ye et al, 2003b. In SiC based power electronics due to high operating temperature, Q * becomes considerable also for interconnects and vias.…”

Section: Physics Of Thermomigration Processmentioning

confidence: 99%

A computational damage mechanics model for thermomigration

Basaran

2009

Mechanics of Materials

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“…It is well known that the high current density and high temperature gradient induce mass migration that degrades the solder joints (Ye, 2004;Ye et al, 2003a;2003e). The two primary mass migration processes that manifest in solder joints subjected to high current density are electromigration and thermomigration (Ye, 2004;Ye et al, 2003a;2003b;2003c;2003e;Basaran et al, 2003;Huang et al, 2006;).…”

Section: Introductionmentioning

confidence: 99%

“…Electromigration causes mass accumulation and hillocks formation in the anode side, and vacancy condensation and void formation in the cathode side (Ye et al, 2003a;2003e). Both hillocks and voids will cause the degradation of the solder joint and eventual failure.…”

Section: Introductionmentioning

confidence: 99%

Thermomigration in lead-free solder joints

Abdulhamid

Basaran

2008

IJMSI

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Abstract:In the next generation nanoelectronics and SiC based electronic packaging, current density and temperature gradient will be larger in orders of magnitude. Electromigration and thermomigration are considered to be major road blocks leading to realisation of nanoelectronics and SiC based high temperature power electronics. In this paper, damage mechanics of 95.5Sn4Ag0.5Cu (SAC405) lead-free solder joints under high temperature gradients have been studied. This paper presents observations on samples which were subjected to 1000°C/cm thermal gradient for two hours, 286 hours, 712 hours and 1156 hours. It was observed that samples subjected to thermal gradient did not develop a Cu 3 Sn intermetallic compound (IMC) layer at the hot side due to Cu migration to the cold side thus causing insufficient Cu mass concentration to form Cu 3 Sn. On the other hand, in samples subjected to isothermal annealing exhibited IMC growth. In samples subjected to thermomigration, near the cold side the Cu concentration is significantly higher, compared to hot side. Extensive surface hardness testing showed increase in hardness from the hot to cold sides, which indicates vacancy migration and Sn grain coarsening are in the opposing direction.

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Damage mechanics of microelectronics solder joints under high current densities

Cited by 55 publications

References 8 publications

Astronautic PBGA (plastic ball grid array) solder joints’ reliability: under successive-high acceleration shock condition

Astronautic PBGA (plastic ball grid array) solder joints’ reliability: under successive-high acceleration shock condition

A computational damage mechanics model for thermomigration

Thermomigration in lead-free solder joints

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