D-Band Compact and High Gain Pyramid Dielectric Antenna Array Using Silicon Technology

Usama, Enass; Basha, Mohammad Abd Alkhalik; Safavi‐Naeini, Safieddin

doi:10.1109/antem.2018.8573012

Cited by 2 publications

(1 citation statement)

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“…6. Lastly, excellent gain and efficiency performance from a pair of high-resistivity silicon DRAs was reported in [92], although co-production with active electronics is unfeasible on the undoped silicon.…”

Section: Superstrate and Dielectric Antennasmentioning

confidence: 99%

A Review of Design and Integration Technologies for D-Band Antennas

Kok

Smolders

Johannsen

2021

IEEE Open J. Antennas Propag.

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This article reviews the current state-of-the-art of millimeter-wave (mm-wave) antennas for communication and sensing applications in the D-band between 110 and 170 GHz. The most popular design techniques, including Antenna-on-Board (AoB), slotted waveguides, Antenna-in-Package (AiP) and Antenna-on-Chip (AoC), are described using relevant examples from scientific literature. Potential benefits and limitations of integration technologies, such as specialized packaging, chip post-processing steps and interconnects, are listed as well. The reported performances of all listed designs are compared against each other, taking the antenna size relative to operating frequency into account. This novel comparison indicates that small-scale integrated AiP and AoC designs can achieve competitive performance levels with short and low-loss interconnects.Index Terms-Antenna-in-Package, Antenna-on-Board, Antenna-on-Chip, D-band, millimeter-Wave This document is a result of the NEXTPERCEPTION project (www.nextperception.eu), which is jointly funded by the European Commission and national funding agencies under the ECSEL joint undertaking.

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Section: Superstrate and Dielectric Antennasmentioning

confidence: 99%