Cycloaliphatic epoxy oligosiloxane‐derived hybrid materials for a high‐refractive index LED encapsulant

Yang, SeungCheol; Kim, Joon‐Soo; Jin, Jungho; Kwak, Seung‐Yeon; Bae, Byeong‐Soo

doi:10.1002/app.34375

Cited by 38 publications

(33 citation statements)

References 21 publications

(29 reference statements)

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“…Recently, we reported an organic/inorganic hybrid material (hybrimer) fabricated by the photocationic polymerization of sol–gel‐derived cycloaliphatic epoxy oligosiloxane (CAEO) resins with a high viscosity. Because of the high transparency, photopatternability, and excellent gas barrier properties, CAEO hybrimers have been used in manifold applications, such as encapsulants for organic light‐emitting diodes 17–19. However, the low photocationic polymerization speed of cycloaliphatic epoxy groups and the limited crosslinking density of CAEO hybrimers, originating from the high viscosity of the CAEO resin, can degrade the basic physical properties of CAEO hybrimers.…”

Section: Introductionmentioning

confidence: 99%

Photocurable transparent cycloaliphatic epoxy hybrid materials crosslinked by oxetane

Yang¹,

Jin²,

Kwak³

et al. 2012

J of Applied Polymer Sci

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Organic/inorganic hybrid materials (hybrimers) were fabricated by the photocationic polymerization of sol-gel-derived cycloaliphatic epoxy oligosiloxane (CAEO)/oxetane blends. The CAEO/oxetane blends showed faster photocationic polymerization rates compared to a CAEO resin. The CAEO/oxetane hybrimers showed a high crosslinking density and flexibility with the addition of oxetane monomer. The increased crosslinking density improved the insulation properties and lowered their dielectric constant. The CAEO/oxetane hybrimer with a substantial thickness of 2 mm showed high transparency (>90%) in the visible range. On the basis of these properties, the CAEO/oxetane hybrimers could be applied to various applications, including optics and display fields.

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Section: Introductionmentioning

confidence: 99%

Photocurable transparent cycloaliphatic epoxy hybrid materials crosslinked by oxetane

Yang¹,

Jin²,

Kwak³

et al. 2012

J of Applied Polymer Sci

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“…The accumulated mechanical stresses may have reduced the overall LED reliability. Bae et al . mentioned that LED encapsulants should have a proper hardness to protect the LED die from the stress shock and humidity corrosion of the LED devices during operation.…”

Section: Resultsmentioning

confidence: 99%

Effects of hydrosilyl monomers on the performance of polysiloxane encapsulant/phosphor blend based hybrid white‐light‐emitting diodes

Chang

Lai

Chiou

et al. 2016

J of Applied Polymer Sci

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Polysiloxane-based encapsulants were prepared by a hydrosilylation reaction of methacryl polyhedral oligomeric silsesquioxane and different hydrosilyl monomers. With the wavelength conversion method, white-light-emitting diodes (WLEDs) were produced by the application of a thermally cured polysiloxane encapsulant/phosphor composite as a wavelength converter on bluelight-emitting InGaN diodes. The color rendering index, the Commission Internationale de l' Eclairage coordinates, correlated the color temperature, and the luminous efficacy of the WLEDs with different encapsulants were evaluated. The effects of the chemical structures of hydrosilyl monomers on the optical, mechanical, and thermal resistance properties of the encapsulants, together with the performance of the WLEDs, were investigated.

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“…[29] The peaks at −57.8 and −67.4 ppm are assigned to the silicon in (R 1 )SiO 3/2 units (R 1 = 3-glycidoxypropyl). [30] Based on the FTIR, 1 H-NMR, and 29 Si-NMR analyses, it can be concluded that PSREA was successfully prepared.…”

Section: Structural Characterization Of Psreamentioning

confidence: 98%

Synthesis of phenyl silicone resin with epoxy and acrylate group and its adhesion enhancement for addition-cure silicone encapsulant with high refractive index

Pan

Zeng

et al. 2016

Journal of Adhesion Science and Technology

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2016): Synthesis of phenyl silicone resin with epoxy and acrylate group and its adhesion enhancement for addition-cure silicone encapsulant with high refractive index, Journal of Adhesion Science and Technology To link to this article: http://dx.a college of Materials science and engineering, south china university of Technology, guangzhou, People's republic of china; b guangdong sheensun Technology co., ltd., foshan, People's republic of china ABSTRACTA novel phenyl silicone resin with epoxy and acrylate group (PSREA) was successfully synthesized via the non-hydrolytic sol-gel condensation reaction of 3-glycidoxypropyltrimethoxysilane, 3-methacryloyloxypropylmethyldimethoxysilane, and diphenylsilanediol, and was employed as the adhesion promoter for additioncure silicone encapsulant (ASE) with high refractive index. The structure of PSREA was confirmed by Fourier transform infrared spectroscopy, 1 H nuclear magnetic resonance spectroscopy, and 29 Si nuclear magnetic resonance spectroscopy. The influence of PSREA on the properties of ASE was studied. It was found that PSREA could markedly enhance the adhesion strength of ASE to aluminum (Al) and poly(p-phenylene terephthamide) (PPA) substrate. When the content of PSREA was 1.5 phr, the shear strength of ASE was 4.43 and 2.27 MPa for Al and PPA substrate, which was about 71 and 266% higher than that of ASE without the adhesion promoter, respectively. In addition, PSREA had little effect on the mechanical properties, refractive index, and viscosity of ASE.

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Cycloaliphatic epoxy oligosiloxane‐derived hybrid materials for a high‐refractive index LED encapsulant

Cited by 38 publications

References 21 publications

Photocurable transparent cycloaliphatic epoxy hybrid materials crosslinked by oxetane

Photocurable transparent cycloaliphatic epoxy hybrid materials crosslinked by oxetane

Effects of hydrosilyl monomers on the performance of polysiloxane encapsulant/phosphor blend based hybrid white‐light‐emitting diodes

Synthesis of phenyl silicone resin with epoxy and acrylate group and its adhesion enhancement for addition-cure silicone encapsulant with high refractive index

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