Current utilization of waste biomass as filler for wood adhesives: A review

Li, Yongfeng; Mo, Hailin; Xie, Enjun; Fang, Jianlin; Gan, Wee Liang

doi:10.1016/j.jiec.2022.08.016

Cited by 17 publications

(4 citation statements)

References 134 publications

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“…In practice, various types of flour are most often added as fillers, mainly rye flour or wheat flour [8]. However, according to Liu et al [9], the search for alternatives is gaining a lot of attention due to the waste of grain resources that could be used in the food industry. It is estimated that 1.5-2.0 million tons of flour were introduced as a filler in plywood production in 2021 [10].…”

Section: Introductionmentioning

confidence: 99%

Modified Buckwheat Husk as a Filler for Urea–Formaldehyde Resin in Plywood Production

Kawalerczyk,

Walkiewicz,

Sedliačik

et al. 2024

Polymers

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The aim of the presented research was to determine the suitability of both non-modified and modified buckwheat husk (BH) as a filler for urea–formaldehyde adhesive in plywood production. The effect of two modification methods, acetylation and silanization, was investigated. Infrared spectroscopy outcomes confirmed that both acetylation and silanization of the filler had occurred. Based on the results, it was found that the introduction of BH had a significant effect on both the adhesive properties and the characteristics of the manufactured plywood. The application of non-modified husks led to a reduction in viscosity and an extension of the gelation time, and the produced plywood boards were characterized by reduced bonding quality and increased delamination. Modification of the husk surface by acetylation and silanization with 3-aminopropyltriethoxysilane contributed to the noticeable improvement in the resin properties. On the other hand, the improvement in plywood properties, consisting of the increase in bonding quality and reduced delamination, was observed only in the case of the silanized husk. Furthermore, the use of non-modified and acetylated husk did not significantly influence the formaldehyde emission. The reduction in the investigated emission of formaldehyde was observed only in the case of variants containing 15 and 20% of silanized buckwheat husk.

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Section: Introductionmentioning

confidence: 99%

Modified Buckwheat Husk as a Filler for Urea–Formaldehyde Resin in Plywood Production

Kawalerczyk,

Walkiewicz,

Sedliačik

et al. 2024

Polymers

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“…Various fillers are utilized for plywood production both domestically and internationally. These include wheat flour, coconut shell powder, bark powder, mineral powder, soybean powder, wood powder, and lightweight calcium carbonate, among other mineral components [7]. In particular, domestically, flour is widely employed as a filler for urea-formaldehyde resin adhesive within the plywood industry, with an annual consumption of approximately 300,000 tons.…”

Section: Introductionmentioning

confidence: 99%

Research on the Preparation of Wood Adhesive Active Fillers from Tannin-/Bentonite-Modified Corn Cob

Yang,

Quan,

et al. 2024

Forests

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The artificial plywood industry in our country relies heavily on industrial flour as a filler for adhesives. Using abundant corn cob powder as the main raw material, corn cob powder was modified by impregnation with a sodium-based bentonite/bayberry tannin and used as filler for urea–formaldehyde resin (UF) adhesive, with NH4Cl as the curing agent and poplar veneer as the raw material to prepare plywood. The results showed that the modified corn cob powder with a particle size of 250 mesh was uniformly dispersed in the UF adhesive. When used as a filler, the modified corn cob powder effectively prevented the premature curing of the UF adhesive and significantly reduced its viscosity. Compared with flour filler, the bonding strength of the prepared plywood increased by 12.1%–19.6% while the formaldehyde emission decreased by 12.7%–27.8%. The cold pressing performance of the plywoods prepared with modified corn cob flour was comparable to the performance of plywood produced with industrial flour.

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“…However, most of these adhesives are fossil resource-based, and many releases toxic gases such as formaldehyde, which contribute to environmental issues and human health problems (Fang et al, 2021;Jiang et al, 2017). Therefore, with the depletion of oil resources, serious environmental pollution, the strengthening of environmental awareness and the improvement of living standards, there is strong interest in developing eco-friendly and renewable bio-based adhesives in the wood-based panel industry (Arias et al, 2021;Eisen et al, 2020;Heinrich, 2019;Li et al, 2018;Liu et al, 2022).…”

Section: Introductionmentioning

confidence: 99%

A High Curing Efficiency Sucrose-based Adhesive via two-step modification by Toluene-4-sulfonic Acid and Methylenediphenyl Diisocyanate

Lin

Cai

Xue

et al. 2023

Preprint

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Sucrose-based adhesives utilize renewable biomass material sucrose as the main ingredient, which are eco-friendly and non-toxic, making them attractive potential substitutes for formaldehyde-based wood adhesives. However, wood-based panel processing using sucrose-based adhesives requires extraordinary harsh conditions with high hot-pressing temperatures (≥170 ℃), limiting practical applications. In this study, the sucrose-based adhesive (SD adhesive) was modified by toluene-4-sulfonic acid (TsOH) and methylenediphenyl diisocyanate (MDI) in two steps. The sucrose-based solution (SS) of the optimal adhesive in the study (SDTM20 adhesive) was synthesized with 5%TsOH catalyst at 100 ℃ for 3h, and then 20%MDI curing agent was added, followed by mixing. After that, the curing behavior, curing mechanism and microscopic characterization was used to analyze the optimal prepared materials. The wet shear strength (0.80 MPa) of the prepared adhesive meets the GB/T 9846-2015 China National Standard (≥0.7 MPa). 13C NMR showed that the TsOH catalyst promoted the formation of aromatic compounds, oligosaccharides and carbonyls, and the 5-HMF content of the SS in SDTM20 adhesive (44.0 g/L) was 158.8% higher than that of SD adhesive. In addition, the thermal curing behavior of SDTM20 adhesive was explained by changes in insoluble mass proportion (IMP) and TG-DSC thermal analysis. From the IMP measurement, SDTM20 adhesive (61.2%) increased by 141.9% compared with the SD adhesive. Additionally, in TG-DTG and DSC curves, the rapid weight loss temperature (145.1 ℃) corresponded to the endothermic reaction temperature (135.3 ℃), implying that the main curing reaction occurred at approximately 140 ℃, indicating that it is possible to improve curing efficiency of SD adhesive. ATR-FTIR was used to evaluate the curing mechanism of the SDTM20 adhesive. After adding TsOH/MDI, the dehydration reaction of sucrose, caramelization reaction, and Maillard reaction were accelerated to improve the curing efficiency. A complex polymeric cross-linking network structure with isocyanurate rings was generated, mainly connected by dimethyl ether bridges. SEM analysis of the microstructure of the adhesive revealed unknown crystal substances and small bubble pores on the fracture surface of the modified SDTM adhesive, showing that a novel cross-linking reaction had occurred.

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Current utilization of waste biomass as filler for wood adhesives: A review

Cited by 17 publications

References 134 publications

Modified Buckwheat Husk as a Filler for Urea–Formaldehyde Resin in Plywood Production

Modified Buckwheat Husk as a Filler for Urea–Formaldehyde Resin in Plywood Production

Research on the Preparation of Wood Adhesive Active Fillers from Tannin-/Bentonite-Modified Corn Cob

A High Curing Efficiency Sucrose-based Adhesive via two-step modification by Toluene-4-sulfonic Acid and Methylenediphenyl Diisocyanate

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