2019
DOI: 10.7567/1347-4065/ab4d23
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Current status and nature of high-frequency electronegative plasmas: basis for material processing in device manufacturing

Abstract: A non-equilibrium electronegative plasma serves as the reactive source for semiconductor dry processing as an advanced technology. This paper reviews the current knowledge about the fundamental processes, structures, dynamics, and functions of high-frequency electronegative plasmas investigated over the past 30 years, and discusses the hidden characteristics originating from a majority of positive and negative ions and a minority of electrons. A unique structure with a negative ion layer is emphasized in terms… Show more

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Cited by 18 publications
(27 citation statements)
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“…( ) with the values of HF-E t N g eff ( ( ) ) in O 2 , 9) Cl 2 , 31,32) N 2 O, 33) and CF 4 39) in addition to the data cited in our previous paper. 14) The results in HF-CCP in Table I are obtained in collision-dominated plasma drived at 13.56 MHz at moderate pressure.…”
Section: Resultsmentioning
confidence: 99%
See 3 more Smart Citations
“…( ) with the values of HF-E t N g eff ( ( ) ) in O 2 , 9) Cl 2 , 31,32) N 2 O, 33) and CF 4 39) in addition to the data cited in our previous paper. 14) The results in HF-CCP in Table I are obtained in collision-dominated plasma drived at 13.56 MHz at moderate pressure.…”
Section: Resultsmentioning
confidence: 99%
“…where τ m and τ e are the momentum and energy relaxation times of the electron, respectively. 3,14) That is, the transport parameter of electrons expressed as a function of the collisional momentum change, such as the drift velocity V d (t) shows strong time-varying characteristics during one period, 2π/ω. On the other hand, the parameter as a function of random energy, for example, the ensemble average of energy 〈ò(t)〉 and the electron attachment rate constant with a low threshold energy, k a (t) have less sensitive behavior in time during the period.…”
Section: Theoreticalmentioning
confidence: 99%
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“…Capacitively Coupled Plasmas (CCPs) represent important reactor types widely used in plasma etching, sputtering, deposition, and cleaning processes providing the basis for semiconductor manufacturing and biomedical applications [1][2][3][4][5]. In such plasmas, efficient control of the particle properties at the electrodes (e.g., the fluxes of chemically reactive species and the ion flux-energy distribution), which determine the plasmasurface interaction, is a basic requirement.…”
Section: Introductionmentioning
confidence: 99%