Current Problems and Possible Solutions in High-Temperature Lead-Free Soldering

Kroupa, Aleš; Andersson, Dag; Hoo, Nick; Pearce, Jeremy; Watson, Andrew; Dinsdale, Alan; Mucklejohn, Stuart A.

doi:10.1007/s11665-012-0125-3

Cited by 71 publications

(31 citation statements)

References 48 publications

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“…These technologies can provide value-added characteristics to the products, including excellent heat conductivity, electric conductivity and high reliability of soldered joints [1]. Appearance of lead-free alternative for high-lead solder Pb-Sn is the main objective in recent years due to EU directive [2].…”

Section: Introductionmentioning

confidence: 99%

Soldering of Copper with High-temperature Zn-based Solders

Prach

Koleňák

2015

Procedia Engineering

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The work deals with the study of interaction Cu substrate (purity 5N) and Zn4Al and Zn6Al6Ag (purity 4N) solders for higher application temperatures. Soldering was performed with power ultrasound in the air without flux application at temperature 420 °C. Acting time of ultrasonic vibration was 5 s. Soldered joints were assessed by optical light microscopy, EDX microanalysis and DSC analysis. It was found out that the melting temperatures of solders were 404.9 °C and 396.9 °C. Intermetallic layers (IM) CuZn 4 and Cu 5 Zn 8 were formed at the Cu/Zn4Al boundary. At the boundary Cu/Zn6Al6Ag there were formed AgZn 3 and Cu 5 Zn 8 IM layers. Shear strength of joint Cu/Zn4Al was 34.5 MPa and shear strength of Cu/Zn6Al6Ag was 39 MPa.

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Section: Introductionmentioning

confidence: 99%

Soldering of Copper with High-temperature Zn-based Solders

Prach

Koleňák

2015

Procedia Engineering

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“…To solve this problem, we used a thin Ag buffer film as the adhesion layer because of solid-state bonding [39,40] and fluidic mobility of a thin Ag film at high temperatures. [41] The FE-SEM image of SiNWs transferred onto Ag-coated Cu foil is shown in Figure 2 b and c, clearly demonstrating a vertically aligned SiNW layer.…”

Section: Resultsmentioning

confidence: 99%

Polymer‐free Vertical Transfer of Silicon Nanowires and their Application to Energy Storage

Kim

Lee

et al. 2013

ChemSusChem

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Silicon nanowires (SiNWs) for use as lithium-ion battery (LIB) anode materials have been studied for their one-dimensional (1D) properties and ability to accommodate large volume changes and avoid rapid capacity fading during cycling. Although the vertical transfer of SiNWs from their original substrate onto a conducting electrode is very important, to date, there has been no report of a direct integration method without polymer binders. Here, we propose for the first time a vertical transfer method for SiNWs grown on a Si substrate directly to the current-collecting electrode without using a polymer adhesive for the use as a binder-free LIB anode. The vertical SiNWs produced using a low-cost wafer-scale metal-assisted chemical etching (MaCE) process have been successfully transferred directly to a copper electrode coated with a thin Ag layer by using a simple hot pressing method. When evaluated as an LIB anode without using conventional polymeric binder and a conducting additive, the transferred vertically aligned SiNWs showed a high specific capacity (≈2150 mAh g(-1) ) and excellent rate performance. It is believed that the anode-manufacturing process is simple and fast, thus enabling a large-scale production that is of low-cost, broadly applicable, and provides new avenues for the rational engineering of Si-based electrode materials with enhanced power density and conductivity.

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“…As a result of EU directives of avoiding the use of lead [1] in solder joints, the attention of soldering at higher application temperatures is especially focused to trying to find most appropriate alloy as a substitute for Pb-Sn solder. The research is focused mainly on Zn based solders with the addition of other elements to lower the melting temperature and improve their properties [2,3,4,5].…”

Section: Introductionmentioning

confidence: 99%

Investigation of the Influence of Alloying Elements in Zn-Al Alloy on Thermal and Mechanical Properties

Kostolný¹,

Koleňák²

2016

DAAAM Proceedings

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The aim of work consist in the investigation of the influence of alloying elements in Zn-Al alloy on thermal and mechanical properties. The Zn-Al(1-5), Zn-Al5-Cu(1-3) and Zn-Al5-Mg(1-3) solder alloys were used experiments. Solders were assessed by DSC analysis and by measuring tensile strength and hardness. It was found out that by adding of alloying elements, the melting temperature is decreasing. The opposite was observed in the case of Zn-Al5-Mg(1-3) alloys. By increasing of wt. % of Al in Zn-Al(1-5) solder, the hardness and tensile strength was increased. In case of ZnAl5-Cu(1-3) and Zn-Al5-Mg(1-3) solder, decreasing of tensile strength and increasing of hardness was observed.

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Current Problems and Possible Solutions in High-Temperature Lead-Free Soldering

Cited by 71 publications

References 48 publications

Soldering of Copper with High-temperature Zn-based Solders

Soldering of Copper with High-temperature Zn-based Solders

Polymer‐free Vertical Transfer of Silicon Nanowires and their Application to Energy Storage

Investigation of the Influence of Alloying Elements in Zn-Al Alloy on Thermal and Mechanical Properties

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