2012
DOI: 10.1016/j.tca.2012.09.012
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Curing of DGEBA epoxy using a phenol-terminated hyperbranched curing agent: Cure kinetics, gelation, and the TTT cure diagram

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Cited by 60 publications
(45 citation statements)
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“…The good miscibility can be explained by structural similarity between EHBPE modifiers and DGEBA and by the higher reactivity of terminal epoxide group in EBHPE, which ensures the incorporation of EHBPE (into the 15 crosslink network) in the early stage of cure and prevent phase separation. 19 The full width at half maxima (FWHM) of tanδ may reveal additional information such as miscibility and homogeneity and is listed in Table 2. At 3%, 5%, and 10% loadings, FWHM of 20 hybrids containing EHBPE-4C are all narrower than that of the neat system, suggesting that addition of EHBPE-4C appears to result in a more homogeneous network.…”
Section: Curing and Performance Sections (1) Ftir Characterizationsmentioning
confidence: 99%
“…The good miscibility can be explained by structural similarity between EHBPE modifiers and DGEBA and by the higher reactivity of terminal epoxide group in EBHPE, which ensures the incorporation of EHBPE (into the 15 crosslink network) in the early stage of cure and prevent phase separation. 19 The full width at half maxima (FWHM) of tanδ may reveal additional information such as miscibility and homogeneity and is listed in Table 2. At 3%, 5%, and 10% loadings, FWHM of 20 hybrids containing EHBPE-4C are all narrower than that of the neat system, suggesting that addition of EHBPE-4C appears to result in a more homogeneous network.…”
Section: Curing and Performance Sections (1) Ftir Characterizationsmentioning
confidence: 99%
“…Epoxy resin (EP) is one of the most versatile thermosetting materials in the electronic/electrical industrials, owing to its excellent mechanical properties and chemical resistance . Free of volatile byproducts during cure and low curing shrinkage make it desirable for structural matrix, adhesive, and composites . In general, electronic/electrical products require flame‐retardancy grade to guarantee the use safety in heated environment.…”
Section: Introductionmentioning
confidence: 99%
“…[31][32][33] When those HBPs with ether groups in the backbones were added into diglycidyl ether of bisphenol-A (DGEBA) epoxy to form hybrids, the cured hybrids materials did not show improvements in the tensile strength and T g , because a significant amount of soft segments were presented in those HBPs. [31][32][33] When those HBPs with ether groups in the backbones were added into diglycidyl ether of bisphenol-A (DGEBA) epoxy to form hybrids, the cured hybrids materials did not show improvements in the tensile strength and T g , because a significant amount of soft segments were presented in those HBPs.…”
Section: Introductionmentioning
confidence: 99%